2315405-1

Key features

• Nano MQS contact press-out force >15N, feed rate 25mm/min
• Solder bracket pull-out force >60N, feed rate 25mm/min
• Interface compliant with 114-94000-17, Version B1, dated April 29, 2016, Revision 1, and 208-18060 Version A1
• Soldering process: lead-free reflow soldering per JEDEC J-STD-020D
• Interface not subject to PPAP; TE Connectivity responsible for connector system
• Tolerances per DIN EN ISO 8015, DIN EN ISO 14405-1
• General tolerances per DIN 16742 T65, except angular dimensions (see title block)
• Packaging: tape and reel per V2315405
• Solder bracket surface: 3-8μm tin over 1-2.5μm nickel
• Contact surface solder side: 3-8μm tin over 1-2.5μm nickel; mating side tin per 114-94201
• For missing dimensions, refer to CAD model X-2315405-X, Revision A
• Good part marking area: stamped marking or laser marking
• 100% electrical final inspection for continuity, short circuits, and presence of all contacts
• Reference points A5, 6, 7, 8 opposite to A1, 2, 3, 4
• Vacuum pick-up area free of burrs and ejector pins (diameter 10mm)
• Color identification marking for C samples
• For additional variants, refer to series drawing 2331611
• Location of housing part number, revision, and material marking may differ between series and pre-series
• Cutouts with smooth stamped edges
• Good part marking for semi-automatic production line
• Pin optional, no electrical function in CPA connector