Varnitronics
5499141-3 TE Connectivity
TE Connectivity

5499141-3

2.54mm Right Angle 16P Tin -65℃~+105℃ 8 2x8P 2 2.54mm Through Hole,Right Angle Headers, Male Pins RoHS

Through Hole,Right AngleROHS3 CompliantActive
Manufacturer
TE Connectivity
Manufacturer part #
5499141-3
Store part #
C17445285
Package / case
Through Hole,Right Angle
Packaging
Tray
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

2 in stock

#C17445285

Stock & price checked 15 h ago

QuantityUnit pricePack price
1+₹982.50₹982.50
10+₹962.64₹9,626.40
56+₹949.46₹53,169.76
112+₹936.09₹1,04,842.08

1 × ₹982.50

₹982.50

excl. GST

₹1,159.35 incl. 18% GST

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  • GST invoice with every order
  • Standard pack: 56 per tray

5499141-3

₹982.50 for 1 + GST

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Specifications

Pitch
2.54mm
Connector Type
Right Angle
Number of PINs
16P
Contact Plating
Tin
Operating Temperature
-65℃~+105℃
Contact Material
Brass
X-Length of Bottom Edge on Board (Spacing Line)
39.62mm
Number of PINs Per Row
8
Pin Structure
2x8P
Number of Rows
2
Row Spacing
2.54mm

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tray
Standard pack
56 / Tray
Sold per
Piece
Minimum order
1
Unit weight
9.049 g

Overview

For clarity, the pop-up latch is omitted from this view. See tables and notes on page 2. 1. Dimensioned coordinates apply from the basic position. The 10 and 14 pin sizes contain only one slot for a snap-in polarizer (polarization), located as shown. 3. The 10 pin size contains only one slot for dual polarization, located as shown. 4. Recommended PCB thickness is 1.57 [.062]. 5. Distance required for the ejector latch in the open position. Housing and latch: glass-filled nylon or polyester, UL94V-0 rated, color per table. Contacts: brass. 7. Contacts: flash gold over palladium-nickel plating, minimum total thickness 0.76μm [.000030] over selective plating area, minimum tin plating thickness 2.54μm [.000100] on solder tail, minimum nickel underplate thickness 1.27μm [.000050] over entire contact. Alternatively, minimum gold plating thickness 0.76μm [.000030] over selective plating area, minimum tin plating thickness 2.54μm [.000100] on solder tail, minimum nickel underplate thickness 1.27μm [.000050] over entire contact. Datums M and N are determined by the customer.

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