TE Connectivity

5499923-9

Through Hole 250V 20 2 2.54mm 1A 40P Tin -65℃~+105℃ Black 2x20P 2.54mm Through Hole Headers, Male Pins RoHS

Through HoleROHS CompliantActive

Manufacturer: TE Connectivity
Manufacturer part #: 5499923-9
Store part #: C17211135
Package / case: Through Hole
Category: Headers, Male Pins
Packaging: Tray

Datasheet (PDF)

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31 in stock

#C17211135

Stock & price checked 13 days ago

Quantity	Unit price	Pack price
1+	₹2,000.40	₹2,000.40
10+	₹1,761.26	₹17,612.60
24+	₹1,615.62	₹38,774.88
96+	₹1,493.32	₹1,43,358.72

Quantity (min 1)

1 × ₹2,000.40

₹2,000.40

excl. GST

₹2,360.47 incl. 18% GST

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Dispatch in 15-18 working days
GST invoice with every order
Standard pack: 24 per tray

5499923-9

₹2,000.40 for 1 + GST

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Specifications

Connector Type: Through Hole
Voltage Rating (Max): 250V
Contact Material: Brass
Number of PINs Per Row: 20
Number of Rows: 2
Pitch: 2.54mm
Current Rating: 1A
Number of PINs: 40P
Contact Plating: Tin
Operating Temperature: -65℃~+105℃
Plastic Material: Glass fiber reinforced PA
Color: Black
X-Length of Bottom Edge on Board (Spacing Line): 70.1mm
Pin Structure: 2x20P
Row Spacing: 2.54mm

Packaging & compliance

RoHS: ROHS Compliant
Lifecycle: Active
ECCN: EAR99
Packaging: Tray
Standard pack: 24 / Tray
Sold per: Piece
Minimum order: 1
Unit weight: 15.267 g

Overview

- Pop-up latch omitted from this view for clarity. - View S - S - Detail V, Scale 10:1 - Coordinate dimensions apply from basic position. - 10 and 14 pin sizes include only one slot for snap-in polarizer (dual polarization), position as shown. - Recommended PCB thickness: 3.18 [0.125]. - Distance required for pop-up latch in open position. - Material: housing and latch — glass-filled nylon or polyester, UL94V-0 rated, black; contacts — phosphor bronze or brass. - Contacts: in selective plating area, gold flash over palladium-nickel, minimum total thickness 0.38μm [0.000015]; solder tail minimum tin plating thickness 2.54μm [0.000100]; minimum nickel underplate thickness 1.27μm [0.000050] over entire contact; or, in selective plating area minimum gold plating thickness 0.38μm [0.000015], solder tail minimum tin plating thickness 2.54μm [0.000100], minimum nickel underplate thickness 1.27μm [0.000050] over entire contact. - Datums - M - and - N - are customer-defined.

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