C2220C204KBGLCAUTO

KEMET C0G surface mount capacitors with KONNEKT technology are designed for high-efficiency and high-density power applications. KONNEKT high-density packaging technology uses innovative transient liquid phase sintering (TLPS) material to create a surface mount multi-chip solution for high-density packaging. Leveraging KEMET's powerful proprietary C0G base metal electrode (BME) dielectric system, these capacitors are ideal for power converters, inverters, snubbers, and resonators where high efficiency is required. With an operating temperature range up to 125°C, these capacitors can be mounted close to fast-switching semiconductors in high power density applications that require minimal cooling. Compared to other dielectric technologies, C0G with KONNEKT technology also offers higher mechanical strength, allowing capacitor mounting without a metal frame. The C0G with KONNEKT technology series complements the KC-LINK with KONNEKT technology series by offering a wider voltage range and an operating temperature range up to 125°C.

Applications

• Wide Bandgap (WBG), SiC, and GaN systems
• Data centers, EV/HEV (drive systems, charging)
• LLC resonant converters
• Switched-tank converters
• Wireless charging systems
• Photovoltaic systems
• Power converters
• Inverters
• DC bus
• Snubbers

Key features

• Extremely high power density and ripple current capability
• Ultra-low ESR
• Ultra-low ESL
• Capacitance range: 0.78 nF - 1.4 μF
• DC voltage rating: 50 - 3000 V
• EIA case sizes: 1812 and 2220
• Operating temperature range: -55°C ~ +125°C
• Capacitance stable vs. voltage
• No piezoelectric noise
• High thermal stability
• SMT compatible with standard MLCC reflow soldering process