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MMBT5551Bipolar (BJT) Transistor NPN 160V 600mA 100MHz 300mW Surface Mount SOT-23
From
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80,72,000 in stock
NexperiaDatasheet (PDF)
PBSS4330PASX
Bipolar (BJT) Transistor NPN 30V 3A 210MHz 1.5W Surface Mount DFN2020D-3
DFN2020D-3ROHS3 CompliantActive
TRANS NPN 30V 3A DFN2020D-3
- Manufacturer
- Nexperia
- Manufacturer part #
- PBSS4330PASX
- Store part #
- C551925
- Package / case
- DFN2020D-3
- Category
- Single Bipolar Transistors
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
8,732 in stock
#C551925
Stock & price checked 8 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹73.80 | ₹73.80 |
| 10+ | ₹59.43 | ₹594.30 |
| 30+ | ₹52.25 | ₹1,567.50 |
| 100+ | ₹45.06 | ₹4,506.00 |
| 500+ | ₹40.71 | ₹20,355.00 |
| 1,000+ | ₹38.54 | ₹38,540.00 |
1 × ₹73.80
₹73.80
excl. GST
₹87.08 incl. 18% GST
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 3,000 per reel
PBSS4330PASX
₹73.80 for 1 + GST
Specifications
- Operating Temperature
- -55℃~+175℃
- Current - Collector Cutoff
- 50uA
- Transition frequency(fT)
- 210MHz
- Collector - Emitter Voltage VCEO
- 30V
- Emitter-Base Voltage VEBO
- 6V
- DC Current Gain
- 180
- Pd - Power Dissipation
- 1.5W
- Current - Collector(Ic)
- 3A
- Configuration
- Standalone
- Number
- 1 NPN
- type
- NPN
- Vce Saturation(VCE(sat))
- 220mV
Packaging & compliance
- RoHS
- ROHS3 Compliant
- Lifecycle
- Active
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 3,000 / Reel
- Sold per
- Piece
- Minimum order
- 1
- Unit weight
- 0.03 g
Overview
NPN low VCEsat transistor encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads. PNP complement: PBSS5330PAS
Applications
- Loadswitch
- Battery-driven devices
- Power management
- Charging circuits
- Power switches (e.g. motors, fans)
Key features
- Low collector-emitter saturation voltage VCEsat
- High collector current capability IC and ICM
- High collector current gain (hFE) at high IC
- High efficiency due to less heat generation
- High temperature applications up to 175 °C
- Reduced Printed-Circuit Board (PCB) area requirements
- Leadless small SMD plastic package with soldarable side pads
- Exposed heat sink for excellent thermal and electrical conductivity
- Suitable for Automatic Optical Inspection (AOI) of solder joint
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