Varnitronics
SH68N65DM6AG ST
ST

SH68N65DM6AG

650V 64A 41mΩ@10V 379W FET, MOSFET Arrays

-RoHSActive
Manufacturer
ST
Manufacturer part #
SH68N65DM6AG
Store part #
C5268686
Package / case
-
Packaging
Tape & Reel (TR)
Datasheet (PDF)

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100% Authentic · 30-Day Return or Replacement · policy

10 in stock

#C5268686

Stock & price checked 25 h ago

QuantityUnit pricePack price
1+₹4,495.42₹4,495.42
10+₹4,388.39₹43,883.90

1 × ₹4,495.42

₹4,495.42

excl. GST

₹5,304.60 incl. 18% GST

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  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 200 per reel

SH68N65DM6AG

₹4,495.42 for 1 + GST

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Specifications

Drain to Source Voltage
650V
Current - Continuous Drain(Id)
64A
Reverse Transfer Capacitance (Crss)
2.6pF
RDS(on)
41mΩ@10V
Pd - Power Dissipation
379W
Ciss-Input Capacitance
5.9nF
Configuration
Half-Bridge
Gate Threshold Voltage (Vgs(th))
3.25V

Packaging & compliance

RoHS
RoHS
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
200 / Reel
Sold per
Piece
Minimum order
1
Unit weight
11.85 g

Overview

This device adopts a half-bridge topology with two integrated MOSFETs. ACEPACK SMIT is an extremely compact and robust power module in a surface-mount package for easy assembly. Thanks to the direct bonded copper (DBC) substrate, the ACEPACK SMIT package features low thermal resistance and is equipped with an isolated top thermal pad. The highly flexible package design supports multiple configurations, enabling half-bridge, boost, and single-switch circuits through different combinations of internal power switches.

Applications

  • Switching applications

Key features

  • AQG 324 certified
  • Half-bridge power module
  • 650 V blocking voltage
  • Fast recovery body diode
  • Ultra-low switching energy
  • Low package inductance
  • Die mounted on direct bonded copper (DBC) substrate
  • Low thermal resistance
  • Isolation rating 3.4 kVrms/min

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