SI7489DP-T1-E3

MOSFETs for switching applications are now available with die on resistances around 1 mΩ and with the capability to handle 85 A. PowerPAK is a new package technology that addresses these issues. The PowerPAK SO - 8 utilizes the same footprint and the same pin - outs as the standard SO - 8. This allows PowerPAK to be substituted directly for a standard SO - 8 package. Being a leadless package, PowerPAK SO - 8 utilizes the entire SO - 8 footprint, freeing space normally occupied by the leads, and thus allowing it to hold a larger die than a standard SO - 8. The bottom of the die attach pad is exposed for the purpose of providing a direct, low resistance thermal path to the substrate the device is mounted on. The package height is lower than the standard SO - 8, making it an excellent choice for applications with space constraints. The PowerPAK single is simple to use. The pin arrangement and the pin dimensions are the same as standard SO - 8 devices. The PowerPAK device connection pads match directly to those of the SO - 8. The only difference is the extended drain connection area. The pin arrangement and the pin dimensions of the PowerPAK SO - 8 dual are the same as standard SO - 8 dual devices. The PowerPAK device connection pads match directly to those of the SO - 8. The only exception is the extended drain connection area.

Key features

• Halogen-free According to IEC 61249-2-21 Available TrenchFET® Power MOSFET
• RoHS COMPLIANT HALOGEN FREE Available
• P-Channel MOSFET