SN74ABT2240APWR

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the ’ABT2241 and ’ABT2244A, these devices provide combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary OE and OE inputs. These devices feature high fan-out and improved fan-in. These devices are organized as two 4-bit line drivers with separate OE inputs. When overline{OE} is low, the devices pass inverted data from the A inputs to the Y outputs. When overline{OE} is high, the outputs are in the high-impedance state. The outputs, which are designed to sink up to 12mA, include equivalent 25-Ω series resistors to reduce overshoot and undershoot. To ensure the high-impedance state during power up or power down, overline{OE} should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74ABT2240A is characterized for operation from -40℃ to 85℃.

Applications

• Three-state memory address driver
• Clock driver
• Bus-oriented receivers and transceivers

Key features

• Output Ports Have Equivalent 25-Ω Series Resistors, So No External Resistors Are Required
• State-of-the-Art EPIC-IIB BiCMOS Design Significantly Reduces Power Dissipation
• Typical VOLP (Output Ground Bounce) < 1 V at Vcc = 5 V, TA = 25 ℃
• Latch-Up Performance Exceeds 500 mA Per JESD 17
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (ΔC = 200 pF, R = 0)
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package