Varnitronics
SN74AHCT16541DGGR TI
TI

SN74AHCT16541DGGR

4.5V~5.5V 16 1 9.5ns@5V,50pF TSSOP-48-6.1mm Buffers, Drivers, Receivers, Transceivers RoHS

TSSOP-48-6.1mmROHS3 CompliantActive

16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

Manufacturer
TI
Manufacturer part #
SN74AHCT16541DGGR
Store part #
C2870740
Package / case
TSSOP-48-6.1mm
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

10 in stock

#C2870740

Stock & price checked 22 h ago

QuantityUnit pricePack price
1+₹527.94₹527.94
10+₹515.81₹5,158.10
30+₹507.57₹15,227.10
100+₹499.55₹49,955.00

1 × ₹527.94

₹527.94

excl. GST

₹622.97 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 2,000 per reel

SN74AHCT16541DGGR

₹527.94 for 1 + GST

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Specifications

Function
Output enable
Current - Output High(IOH)
8mA
Voltage - Supply
4.5V~5.5V
Series
74AHCT
Output Type
Tri-State
Current - Output Low(IOL)
8mA
Number of Bits per Element
16
Number of Elements
1
Operating Temperature
-40℃~+85℃
Quiescent Supply Current
40uA
Propagation Delay
9.5ns@5V,50pF

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
2,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.66 g

Overview

The AHCT16541 device is a noninverting 16-bit buffer consisting of two 8-bit sections with separate output-enable inputs. For either 8-bit section, both output-enable inputs (1OE1 and 1OE2, or 2OE1 and 2OE2) must be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 8-bit section are in a high-impedance state. To ensure the high-impedance state during power-up or power-down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74AHCT16541 operates over a temperature range of -40°C to 85°C.

Key features

  • Members of the Texas Instruments Widebus Family
  • EPIC (Enhanced-Performance Implanted CMOS) Process
  • Inputs Are TTL-Voltage Compatible
  • Distributed Vcc and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds ±50 mA Per JESD 17
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

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