SN74ALVTH162244DL

The ALVTH162244 device is a 16-bit buffer/line driver designed for low-voltage 2.5-V or 3.3-V VCC operation while providing TTL interface capability for 5-V system environments. These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide noninverting outputs and symmetric active-low output enable (OE) inputs. An active bus-hold circuit keeps unused or floating data inputs at a valid logic level. When VCC is between 0 V and 1.2 V, the device is in a high-impedance state during power-up or power-down. To ensure the high-impedance state above 1.2 V, the active-low output enable OE should be connected to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. All outputs are designed to sink up to 12 mA and include an equivalent 30-Ω resistor to reduce overshoot and undershoot. The SN74ALVTH162244 operates over a temperature range of -40°C to 85°C.

Key features

• Widebus™ design using Advanced BiCMOS Technology (ABT), supporting 2.5V and 3.3V operation with low quiescent power consumption
• Mixed-mode signal operation support (5V I/O voltage at VCC from 2.3V to 3.6V)
• Typical VOLP (output ground bounce) < 0.8V at VCC = 3.3V, TA = 25℃
• Output enable during power-down for hot insertion support
• High-impedance output state during power-up and power-down to prevent driver contention
• Bus-hold on data inputs — no external pull-up/pull-down resistors required to prevent bus float
• Integrated equivalent 30-Ω series resistors on output ports — no external resistors required
• Auto-tristating eliminates bus current loading when output voltage exceeds VCC + 0.5V
• Latch-up performance exceeds 250 mA per JESD 17
• Flow-through architecture for simplified PCB layout
• Distributed VCC and GND pin configuration to reduce high-speed switching noise
• Package options include plastic reduced small-outline (DL), thin reduced small-outline (DGG), thin very small-outline (DGV), and 380-mil fine-pitch ceramic flat (WD) packages