SN74LVT16245BDGGR

The 'LVT16245B devices are 16-bit (dual-octal) noninverting 3-state transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices are designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input and the output-enable (OE) input activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode. The device transmits data from the A bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ. When VCC is between 0 and 1.5V the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5V OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

Applications

• Asynchronous data communication between two data buses
• Hot-plug applications

Key features

• Member of the Texas Instruments Widebus Family
• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
• Support Unregulated Battery Operation Down to 2.7 V
• Typical VOLP (Output Ground Bounce) < 0.8V at VCC = 3.3V, TA = 25℃
• Ioff and Power-Up 3-State Support Hot Insertion
• Distributed VCC and GND Pins Minimize High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22:
• 2000-V Human-Body Model (A114-A)
• 200-V Machine Model (A115-A)
• 1000-V Charged-Device Model (C101)