SN74LVTH16543DGGR

The LVTH16543 device is a 16-bit registered transceiver designed for low-voltage (3.3-V) VCC operation while providing TTL interface capability for 5-V system environments. These devices can be used as two 8-bit transceivers or one 16-bit transceiver. Each register provides separate latch-enable (LEAB or LEBA) and output-enable (OEAB or OEBA) inputs, allowing independent control of either data flow direction. The A-to-B enable (CEAB) input must be low to receive data from A or drive data to B. When CEAB is low and LEAB is low, the A-to-B latch is in transparent mode; a subsequent low-to-high transition on LEAB places the A latch in storage mode. When both CEAB and OEAB are low, the 3-state B outputs are enabled, reflecting the data present at the A latch outputs. Data flow from B to A operates similarly, but uses the CEBA, LEBA, and OEBA inputs. Built-in active bus-hold circuitry maintains unused or floating data inputs at valid logic levels. When VCC is between 0 V and 1.5 V, the device is in a high-impedance state during power-up or power-down. However, to ensure the high-impedance state above 1.5 V, OE should be connected to VCC through a pullup resistor; the minimum resistor value is determined by the current-sinking capability of the driver. These devices use Ioff and power-up 3-state features to fully meet the specifications for hot-plug applications. The Ioff circuit disables the outputs to prevent damaging backflow current when the device is powered down. The power-up 3-state circuit places the outputs in a high-impedance state during power-up and power-down to prevent driver contention. The SN74LVTH16543 operates over a temperature range of -40℃ to 85℃.

Key features

• Widebus family device
• Designed with Advanced BiCMOS Technology (ABT) for 3.3V operation with low quiescent power consumption
• Mixed-mode signal operation support (5V input/output voltage compatible at 3.3V VCC)
• Unregulated battery operation down to 2.7V
• Ioff and power-up 3-state features for hot-insertion support
• Bus-hold on data inputs eliminates external pull-up/pull-down resistors
• Typical output ground bounce (VOLP) < 0.8 V at VCC = 3.3V, TA = 25℃
• Distributed VCC and GND pin configuration minimizes high-speed switching noise
• Flow-through architecture optimizes PCB routing
• Latch-up performance exceeds 500 mA per JESD 17
• Multiple package options: plastic shrink small-outline (DL), thin shrink small-outline (DGG), and 380-mil fine-pitch ceramic flat package (WD) with 25-mil pin pitch