Varnitronics
AUIRF7675M2TR Infineon
Infineon

AUIRF7675M2TR

N-Channel 150V 18A 45W DirectFET

DirectFETROHS3 CompliantActive

MOSFET N-CH 150V 18A DirectFET

Manufacturer
Infineon
Manufacturer part #
AUIRF7675M2TR
Store part #
C533288
Package / case
DirectFET
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

7 in stock

#C533288

Stock & price checked 3 days ago

QuantityUnit pricePack price
1+₹479.76₹479.76
10+₹469.31₹4,693.10
30+₹462.34₹13,870.20
100+₹455.38₹45,538.00

1 × ₹479.76

₹479.76

excl. GST

₹566.12 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 4,800 per reel

AUIRF7675M2TR

₹479.76 for 1 + GST

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Specifications

Output Capacitance(Coss)
190pF
Ciss-Input Capacitance
1.36nF
Pd - Power Dissipation
45W
Operating Temperature
-55℃~+175℃
Drain to Source Voltage
150V
Current - Continuous Drain(Id)
18A
Reverse Transfer Capacitance (Crss)
41pF
RDS(on)
47mΩ@10V
Number
1 N-channel
Gate Charge(Qg)
21nC@75V
Vgs
±20V
Gate Threshold Voltage (Vgs(th))
3V
Type
N-Channel

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
4,800 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.42 g

Overview

AUIRF7675M2TR/TR1 combines the latest automotive HEXFET power MOSFET silicon technology with the advanced DirectFET package platform, delivering a best-in-class solution for automotive Class D audio amplifier applications. When following the manufacturing methods and process guidelines outlined in Application Note AN-1035, the DirectFET package is compatible with existing layout geometries, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques used in power applications. The DirectFET package supports dual-side cooling, maximizing thermal transfer efficiency in automotive power systems. This HEXFET power MOSFET is optimized for gate charge, body diode reverse recovery, and internal gate resistance to improve key performance metrics in Class D audio amplifiers, such as efficiency, total harmonic distortion (THD), and EMI. Furthermore, compared to conventional wire-bond SOIC packages, the DirectFET package platform offers lower parasitic inductance and resistance, improving EMI performance by reducing voltage ringing associated with current transients. These characteristics make this MOSFET a highly attractive component for automotive Class D audio amplifier systems.

Applications

  • Automotive Class-D audio amplifier applications

Key features

  • Optimized for Class-D audio amplifier applications
  • Low on-resistance RDS(ON) for improved efficiency
  • Low gate charge Qg for improved THD and efficiency
  • Low reverse recovery charge Qrr for improved THD and reduced EMI
  • Low parasitic inductance for reduced ringing and EMI
  • Heatsink-free operation, up to 250W per channel into 4Ω load
  • Dual-side cooling
  • Operating temperature up to 175°C
  • Repetitive avalanche capability for robustness and reliability
  • Lead-free, RoHS compliant, and halogen-free
  • Automotive-qualified

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