MDD(Microdiode Semiconductor)
2N7002KN-Channel 60V 300mA 300mW Surface Mount SOT-23
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25,99,250 in stock
NexperiaDatasheet (PDF)
BUK7S0R7-40HJ
N-Channel 40V 425A 375W SOT1235
SOT1235ROHS3 CompliantActive
MOSFET N-CH 40V 425A SOT1235
- Manufacturer
- Nexperia
- Manufacturer part #
- BUK7S0R7-40HJ
- Store part #
- C549900
- Package / case
- SOT1235
- Category
- Single FETs, MOSFETs
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
Out of stock
#C549900
Stock & price checked 36 h ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹720.85 | ₹720.85 |
| 10+ | ₹705.08 | ₹7,050.80 |
| 30+ | ₹694.51 | ₹20,835.30 |
| 100+ | ₹684.15 | ₹68,415.00 |
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 2,000 per reel
Specifications
- Output Capacitance(Coss)
- 2.363nF
- Ciss-Input Capacitance
- 15.719nF
- Pd - Power Dissipation
- 375W
- Operating Temperature
- -55℃~+175℃
- Drain to Source Voltage
- 40V
- Current - Continuous Drain(Id)
- 425A
- Reverse Transfer Capacitance (Crss)
- 415pF
- RDS(on)
- 0.62mΩ@10V
- Number
- 1 N-channel
- Gate Charge(Qg)
- 202nC@10V
- Gate Threshold Voltage (Vgs(th))
- 3.6V
- Type
- N-Channel
Packaging & compliance
- RoHS
- ROHS3 Compliant
- Lifecycle
- Active
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 2,000 / Reel
- Sold per
- Piece
- Minimum order
- 1
- Unit weight
- 0.6 g
Overview
Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability.
Applications
- 12 V automotive systems
- 48 V DC/DC systems (on 12 V secondary side)
- Higher power motors, lamps and solenoid control
- Reverse polarity protection
- LED lighting
- Ultra high performance power switching
Key features
- Fully automotive qualified to beyond AEC-Q101: -55°C to +175°C rating suitable for thermally demanding environments
- LFPAK88 package: Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
- Thin package and copper clip enables LFPAK88 to be highly efficient thermally
- LFPAK copper clip technology enabling improvements over wire bond packages by: Increased maximum current capability and excellent current spreading, Improved RDSon, Low source inductance, Low thermal resistance Rth
- LFPAK Gull Wing leads: Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
- Visual (AOI) soldering inspection, no need for expensive x-ray equipment
- Easy solder wetting for good mechanical solder joint
- Unique 40 V Trench 9 superjunction technology: Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
- Improved SOA and avalanche capability compared to standard TrenchMOS
- Tight VGS(th) limits enable easy paralleling of MOSFETs
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