Nexperia

BUK7S1R5-40HJ

40V 260A 242W 1.5mΩ@10V 1 N-channel N-Channel LFPAK-56 Single FETs, MOSFETs RoHS

LFPAK-56ROHS3 CompliantActive

Manufacturer: Nexperia
Manufacturer part #: BUK7S1R5-40HJ
Store part #: C3288642
Package / case: LFPAK-56
Category: Single FETs, MOSFETs
Packaging: Tape & Reel (TR)

Datasheet (PDF)

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23 in stock

#C3288642

Stock & price checked 3 days ago

Quantity	Unit price	Pack price
1+	₹538.14	₹538.14
10+	₹458.82	₹4,588.20
30+	₹411.65	₹12,349.50
100+	₹363.84	₹36,384.00
500+	₹341.89	₹1,70,945.00
1,000+	₹331.89	₹3,31,890.00

Quantity (min 1)

1 × ₹538.14

₹538.14

excl. GST

₹635.01 incl. 18% GST

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Dispatch in 15-18 working days
GST invoice with every order
Standard pack: 2,000 per reel

BUK7S1R5-40HJ

₹538.14 for 1 + GST

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Specifications

Operating Temperature: -55℃~+175℃
Drain to Source Voltage: 40V
Output Capacitance(Coss): 1.48nF
Current - Continuous Drain(Id): 260A
Ciss-Input Capacitance: 6.712nF
Pd - Power Dissipation: 242W
Reverse Transfer Capacitance (Crss): 502pF
RDS(on): 1.5mΩ@10V
Number: 1 N-channel
Gate Charge(Qg): 93nC@10V
Gate Threshold Voltage (Vgs(th)): 3.6V
Type: N-Channel

Packaging & compliance

RoHS: ROHS3 Compliant
Lifecycle: Active
ECCN: EAR99
Packaging: Tape & Reel (TR)
Standard pack: 2,000 / Reel
Sold per: Piece
Minimum order: 1
Unit weight: 0.587 g

Overview

Automotive-grade N-channel MOSFET utilizing the latest Trench 9 low-ohmic superjunction technology, housed in a copper-clip LFPAK88 package. Fully designed and qualified to meet and exceed AEC-Q101 requirements, delivering high performance and high reliability.

Applications

12 V automotive systems
48 V DC/DC systems (12 V secondary side)
Higher-power motor, lamp, and solenoid control
Reverse polarity protection
LED lighting
Ultra-high-performance power switching

Key features

Fully compliant with and exceeding AEC-Q101 automotive-grade standards
Operating temperature range from -55°C to +175°C, suitable for high thermal dissipation environments
LFPAK88 package: more space-efficient design compared to legacy wire-bond packages such as D2PAK, with improved power density for today's space-constrained high-power automotive applications
Slim package and copper clip enable superior thermal dissipation performance in LFPAK88
LFPAK copper clip technology improvements over wire-bond packages: enhanced maximum current carrying capability with excellent current distribution
Improved on-state resistance RDS(on)
Low source inductance
Low thermal resistance Rth
LFPAK gull-wing leads: flexible leads absorb mechanical and thermal cycling stress for high board-level reliability, unlike conventional QFN packages
Visual (AOI) solder inspection capability — no costly X-ray equipment required
Easy solder wetting for reliable mechanical solder joints
Unique 40V Trench 9 super-junction technology: reduced cell pitch and super-junction platform deliver lower RDS(on) in the same footprint
Improved safe operating area (SOA) and avalanche capability compared to standard TrenchMOS
Tight VGS(th) limits for easy MOSFET paralleling

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