MDD(Microdiode Semiconductor)
2N7002KN-Channel 60V 300mA 300mW Surface Mount SOT-23
From
₹2.32
25,99,250 in stock
NexperiaDatasheet (PDF)
BUK7Y3R1-80MX
254W 80V 160A 2.5mΩ@10V 1 N-channel N-Channel LFPAK56 Single FETs, MOSFETs RoHS
LFPAK56ROHS CompliantActive
- Manufacturer
- Nexperia
- Manufacturer part #
- BUK7Y3R1-80MX
- Store part #
- C29652355
- Package / case
- LFPAK56
- Category
- Single FETs, MOSFETs
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
21 in stock
#C29652355
Stock & price checked 3 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹468.69 | ₹468.69 |
| 10+ | ₹404.26 | ₹4,042.60 |
| 30+ | ₹365.94 | ₹10,978.20 |
| 100+ | ₹327.19 | ₹32,719.00 |
| 500+ | ₹309.34 | ₹1,54,670.00 |
| 1,500+ | ₹301.29 | ₹4,51,935.00 |
1 × ₹468.69
₹468.69
excl. GST
₹553.05 incl. 18% GST
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 1,500 per reel
BUK7Y3R1-80MX
₹468.69 for 1 + GST
Specifications
- Output Capacitance(Coss)
- 1.121nF
- Ciss-Input Capacitance
- 4.896nF
- Pd - Power Dissipation
- 254W
- Operating Temperature
- -55℃~+175℃
- Drain to Source Voltage
- 80V
- Current - Continuous Drain(Id)
- 160A
- Reverse Transfer Capacitance (Crss)
- 53pF
- RDS(on)
- 2.5mΩ@10V
- Number
- 1 N-channel
- Gate Charge(Qg)
- 70nC
- Vgs
- ±20V
- Gate Threshold Voltage (Vgs(th))
- 3V
- Type
- N-Channel
Packaging & compliance
- RoHS
- ROHS Compliant
- Lifecycle
- Active
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 1,500 / Reel
- Sold per
- Piece
- Minimum order
- 1
- Unit weight
- 0.168 g
Overview
Automotive-grade N-channel MOSFET utilizing the latest Trench 14 low-ohmic split-gate technology, featuring ultra-low on-state resistance (\mathsfRDSon) in an LFPAK56 package. Fully designed and qualified to AEC-Q101 requirements, delivering high performance and durability.
Applications
- 12 V, 24 V, and 48 V automotive systems
- Motor, lighting, and solenoid control
- Ultra-high performance power switching
Key features
- Fully compliant with AEC-Q101 automotive standard
- Rated temperature up to 175°C, suitable for high thermal dissipation environments
- Trench 14 split-gate technology:
- Reduced cell pitch for lower R\textDSon in the same die size, improving power density and efficiency
- Fast and efficient switching characteristics with optimized damping and low voltage spikes
- LFPAK gull-wing leads:
- High board-level reliability, absorbs mechanical stress during thermal cycling — unlike conventional QFN packages
- Visual (AOI) solder inspection capability, no expensive X-ray equipment required
- Easy soldering with reliable mechanical solder joints
- LFPAK copper-clip technology:
- Enhanced reliability with reduced Rth, RDSon, and package inductance
- Improved maximum current-carrying capability and better current distribution
Same category
