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NexperiaDatasheet (PDF)
BUK9Y1R6-40HX
N-Channel 40V 120A 294W LFPAK56(PowerSO-8)
LFPAK56(PowerSO-8)ROHS3 CompliantActive
MOSFET N-CH 40V 120A LFPAK56(PowerSO-8)
- Manufacturer
- Nexperia
- Manufacturer part #
- BUK9Y1R6-40HX
- Store part #
- C550041
- Package / case
- LFPAK56(PowerSO-8)
- Category
- Single FETs, MOSFETs
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
1,394 in stock
#C550041
Stock & price checked 9 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹279.26 | ₹279.26 |
| 10+ | ₹236.76 | ₹2,367.60 |
| 30+ | ₹210.32 | ₹6,309.60 |
| 100+ | ₹183.00 | ₹18,300.00 |
| 500+ | ₹170.64 | ₹85,320.00 |
| 1,500+ | ₹165.44 | ₹2,48,160.00 |
1 × ₹279.26
₹279.26
excl. GST
₹329.53 incl. 18% GST
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 1,500 per reel
BUK9Y1R6-40HX
₹279.26 for 1 + GST
Specifications
- Output Capacitance(Coss)
- 1.022nF
- Ciss-Input Capacitance
- 7.563nF
- Pd - Power Dissipation
- 294W
- Operating Temperature
- -55℃~+175℃
- Drain to Source Voltage
- 40V
- Current - Continuous Drain(Id)
- 120A
- Reverse Transfer Capacitance (Crss)
- 458pF
- RDS(on)
- 1.6mΩ@10V
- Number
- 1 N-channel
- Gate Charge(Qg)
- 107.8nC@10V
- Gate Threshold Voltage (Vgs(th))
- 2.05V
- Type
- N-Channel
Packaging & compliance
- RoHS
- ROHS3 Compliant
- Lifecycle
- Active
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 1,500 / Reel
- Sold per
- Piece
- Minimum order
- 1
- Unit weight
- 0.143 g
Overview
Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction technology, housed in a robust LFPAK56 package. This product has been fully designed and qualified to meet AEC-Q101 requirements delivering high performance and endurance.
Applications
- 12 V automotive systems
- Motors, lamps and solenoid control
- Start-Stop micro-hybrid applications
- Transmission control
- Ultra high performance power switching
Key features
- Reduced cell pitch enables enhanced power density and efficiency with lower Rson in same footprint
- Improved SOA and avalanche capability compared to standard TrenchMOS
- Tight VGS(th) limits enable easy paralleling of MOSFETs
- LFPAK Gull Wing leads:
- High Board Level Reliability absorbing mechanical stress during thermal cycling, unlike traditional QFN packages
- Visual (AOI) soldering inspection, no need for expensive x-ray equipment
- Easy solder wetting for good mechanical solder joint
- LFPAK copper clip technology:
- Improved reliability, with reduced Rth and RDSon
- Increases maximum current capability and improved current spreading
Alternatives
Similar parts — check the datasheet before substituting.
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|---|---|---|---|---|---|---|
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