CC2340R22E0RKPR

The CC2340R SimpleLink™ family of devices are 2.4GHz wireless MCUs targeting Bluetooth® Low Energy, Zigbee, Thread, and proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication, support Over-the-Air Download (OAD), and are suited for building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail Electronic Point of Sale (EPOS), Electronic Shelf Labels (ESL), and consumer electronics (toys, HID, stylus) applications. The device supports Bluetooth 5 features: high-speed mode (2Mbps PHY), long range (LE Coded 125kbps and 500kbps PHY), Privacy 1.2.1, and Channel Selection Algorithm #2, while maintaining backward compatibility with key features of earlier Bluetooth LE specifications. The SimpleLink™ Low Power F3 Software Development Kit (SDK) includes a fully qualified Bluetooth software protocol stack. The SimpleLink™ Low Power F3 SDK supports the Zigbee® protocol stack. The SIMPLELINK TI OPENTHREAD SDK supports the Thread protocol stack. Ultra-low standby current of less than 0.71μA with RTC active and full RAM data retention significantly extends battery life, especially for applications with long sleep intervals. Integrated balun reduces BOM and simplifies PCB layout. Bluetooth Low Energy delivers excellent radio sensitivity and robustness (selectivity and blocking rejection) performance, with 125kbps LE Coded PHY sensitivity of -102dBm and an integrated balun. The CC2340R family is part of the SimpleLink™ MCU platform, which encompasses Wi-Fi®, Bluetooth Low Energy, Thread, Zigbee, Sub-1GHz MCU, and host MCU products — all sharing a common, easy-to-use development environment with a single-core SDK and comprehensive toolset. A one-time integration of the SimpleLink™ platform enables any combination of products to be incorporated into a design, enabling 100% code reuse when design requirements change.

Applications

• Medical: home healthcare (blood glucose monitors, blood pressure monitors, CPAP devices, electronic thermometers); patient monitoring and diagnostics (medical sensor patches); personal care and fitness (electric toothbrushes, wearable fitness and activity monitors)
• Building Automation: building security systems (motion detectors, electronic smart locks, door and window sensors, garage door systems, gateways); HVAC (thermostats, wireless ambient sensors); fire safety systems (smoke and heat detectors); video surveillance (IP network cameras)
• Lighting: LED luminaires; lighting control (light sensors, wireless control)
• Factory automation and control
• Retail automation and payment: electronic point-of-sale
• Electronic shelf labels
• Grid infrastructure: smart metering (water, gas, electricity, and heat cost allocators); grid communications (wireless communications, long-range sensor applications); alternative energy (energy harvesting)
• Communications equipment: wired networking; wireless LAN or Wi-Fi access points, edge routers
• Consumer electronics: connected peripherals (consumer wireless modules, pointing devices, keyboards); gaming (electronic and robotic toys); non-medical wearables (smart trackers, smart garments)

Key features

• Optimized 48MHz Arm® Cortex®-M0+ processor
• Up to 512KB in-system programmable flash
• 12KB ROM for bootloader and drivers
• Up to 64KB ultra-low leakage SRAM with full RAM retention in standby mode
• 2.4GHz RF transceiver compatible with Bluetooth® Low Energy and IEEE 802.15.4 PHY and MAC
• Integrated balun
• Over-the-Air (OTA) update support
• Serial Wire Debug (SWD)
• MCU power consumption: Active mode 2.6mA (CoreMark®); 53μA/MHz running CoreMark®; CC2340R52 standby mode current <710nA; shutdown mode 165nA with pin wake-up support
• RF power consumption: RX 5.3mA; 0dBm TX 5.1mA; +8dBm TX <11.0mA
• Multi-protocol wireless support: Bluetooth® LE; LE 2M, LE Coded, periodic advertising, extended advertising, LE Secure Connections; Bluetooth Core 5.4 compliant; Zigbee®; Thread; proprietary
• High-performance RF: Bluetooth® LE Coded 125kbps sensitivity -102dBm; Bluetooth® LE 1Mbps sensitivity -96.5dBm; IEEE 802.15.4 (2.4GHz) sensitivity -98dBm; output power up to +8dBm with temperature compensation
• Compliant with EN 300 328 (Europe), FCC CFR47 Part 15, ARIB STD-T66 (Japan) regulatory standards
• MCU peripherals: Up to 26 I/O pads; 2 SWD I/O pads multiplexed with GPIO; 2 LFXT I/O pads multiplexed with GPIO; up to 22 DIOs (analog or digital I/O); up to three 16-bit and one 24-bit general-purpose timers with quadrature decode and IR generation modes; 12-bit ADC, 1.2Msps (external reference) / 267ksps (internal reference), up to 12 external ADC inputs; 1 low-power comparator; 1 UART; 1 SPI; 1 I2C; RTC; integrated temperature and battery monitor; watchdog timer
• Security features: AES 128-bit encryption accelerator; on-chip analog noise source RNG
• Development tools and software support: LP-EM-CC2340R53 LaunchPad kit; SimpleLink™ Low Power F3 SDK; SmartRF™ Studio for RF configuration; SysConfig system configuration tool
• On-chip integrated buck DC/DC converter
• Single-supply operation, voltage range 1.71V to 3.8V
• Junction temperature range -40℃ to +125℃
• RoHS-compliant package options: 5mm × 5mm RKP QFN40; 4mm × 4mm RGE QFN24; 2.2mm × 2.6mm YBG WCSP