Varnitronics
TOSHIBA

DF2S23P2CTC,L3F

35.7VC Clamp 14A@8/20us Ipp ESD DIODE CST-2-C

CST-2-CROHS3 CompliantActive
Manufacturer
TOSHIBA
Manufacturer part #
DF2S23P2CTC,L3F
Store part #
C1974973
Package / case
CST-2-C
Category
TVS Diodes
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

495 in stock

#C1974973

Stock & price checked 4 days ago

QuantityUnit pricePack price
1+₹59.19₹59.19
10+₹46.83₹468.30
30+₹41.42₹1,242.60
100+₹34.91₹3,491.00

1 × ₹59.19

₹59.19

excl. GST

₹69.84 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 10,000 per reel

DF2S23P2CTC,L3F

₹59.19 for 1 + GST

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Specifications

Clamping Voltage
35.7V
Peak Pulse Current (Ipp)
14A@8/20us
Peak Pulse Power Dissipation (Ppp)
500W@8/20us
Voltage - Breakdown
25.5V
type
ESD
Reverse Leakage Current (Ir)
100nA
Reverse Stand-Off Voltage (Vrwm)
21V

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
10,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.001 g

Overview

The DF2S23P2CTC is a TVS diode (ESD protection diode) protects semiconductor devices used in mobile device interfaces and other applications to protect against static electricity and noise. The DF2S23P2CTC has realized high IPP, in order to protect a semiconductor devices from the indirect lightning stroke and the transition voltage (at the time of power activation). Furthermore, the DF2S23P2CTC is housed in an ultra-compact package (1.6 mm×0.8 mm) to meet applications that require a small footprint.

Applications

  • Mobile Equipment
  • Smartphones
  • Tablets
  • Notebook PCs
  • Desktop PCs

Key features

  • Suitable for use with a 20 V signal line. (VRWM ≤ 21 V)
  • Protects devices with its high ESD performance. (VESD = ±30 kV (Contact / Air) @IEC61000 - 4 - 2)
  • Low dynamic resistance protects semiconductor devices from static electricity and noise. (RDYN = 0.13 Ω (typ.))
  • Snapback characteristics realizing low clamping voltage protects semiconductor devices. (VC = 30 V @IPP = 14 A (typ.))
  • Compact package is suitable for use in high density board layouts such as in mobile devices. 1.6 mm×0.8 mm size (Nickname: CST2C)

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