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MSPM0L1306SDGS28R TI
TI

MSPM0L1306SDGS28R

VSSOP-28 Microcontrollers RoHS

VSSOP-28ROHS3 CompliantActive
Manufacturer
TI
Manufacturer part #
MSPM0L1306SDGS28R
Store part #
C22454997
Package / case
VSSOP-28
Packaging
Tape & Reel (TR)
Datasheet (PDF)

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10 in stock

#C22454997

Stock & price checked 10 days ago

QuantityUnit pricePack price
1+₹335.86₹335.86
10+₹328.05₹3,280.50
30+₹323.06₹9,691.80
100+₹317.85₹31,785.00

1 × ₹335.86

₹335.86

excl. GST

₹396.31 incl. 18% GST

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  • Standard pack: 5,000 per reel

MSPM0L1306SDGS28R

₹335.86 for 1 + GST

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Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
3A991A2
Packaging
Tape & Reel (TR)
Standard pack
5,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
1.86 g

Overview

The MSPM0L134x and MSPM0L130x MCUs are part of a highly integrated, ultra-low-power 32-bit MSPM0 MCU family based on an enhanced Arm® Cortex®-M0+ core platform, operating at up to 32 MHz. These cost-optimized MCUs offer high-performance analog peripheral integration, support a wide temperature range of -40°C to 125°C, and operate from a supply voltage of 1.62 V to 3.6 V. The MSPM0L134x and MSPM0L130x devices provide up to 64 KB of embedded flash program memory and up to 4 KB of SRAM. These MCUs integrate a high-speed on-chip oscillator with up to ±1.2% accuracy, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16-bit and 32-bit CRC accelerators, and a variety of high-performance analog peripherals such as a 12-bit 1.68-MSPS ADC with configurable internal voltage reference, a high-speed comparator with built-in reference DAC, two zero-drift zero-crossover op-amps with programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also provide intelligent digital peripherals including four 16-bit general-purpose timers, one windowed watchdog timer, and multiple communication peripherals including two UARTs, one SPI, and two I2C interfaces. These communication peripherals support LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus protocols. The TI MSPM0 low-power MCU family includes devices with varying levels of analog and digital integration, allowing customers to select the MCU that best meets their project requirements. The architecture, combined with multiple low-power modes, is optimized to extend battery life in portable measurement applications. The MSPM0L134x and MSPM0L130x MCUs are supported by a comprehensive hardware and software ecosystem, including reference designs and code examples for rapid design kick-start. Development kits include an available LaunchPad™ development kit and design files for target socket boards. TI also offers a free MSP Software Development Kit (SDK), available as a component for both the desktop and cloud versions of the Code Composer Studio™ IDE. MSPM0 MCUs are further supported by extensive online resources, MSP Academy training, and online support. For complete module descriptions, refer to the MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.

Applications

  • Battery charging and management
  • Power supplies and power delivery
  • Personal electronics
  • Building security and fire safety
  • Connected peripherals and printers
  • Grid infrastructure
  • Smart metering
  • Communication modules
  • Medical and healthcare
  • Lighting

Key features

  • Arm 32-bit Cortex-M0+ CPU, up to 32 MHz
  • Wide operating temperature range: -40℃ to 125℃
  • Supply voltage range: 1.62 V to 3.6 V
  • Up to 64 KB Flash
  • Up to 4 KB SRAM
  • 1× 12-bit 1.68-Msps ADC, up to 10 external channels
  • ADC with configurable internal voltage reference (VREF): 1.4 V or 2.5 V
  • 2× zero-drift, zero-crossover chopper OPA, chopper mode temperature drift 0.5-µV/℃, input bias current 6-pA, integrated 1–32× programmable gain stage
  • 1× general-purpose amplifier (GPAMP)
  • 1× high-speed comparator (COMP) with 8-bit DAC reference, propagation delay 32-ns, <1-µA current in low-power mode
  • Programmable analog interconnect between ADC, OPA, COMP, and DAC
  • Integrated temperature sensor
  • Optimized low-power modes: RUN mode 71 µA/MHz (CoreMark); STOP mode: 151 µA at 4 MHz, 44 µA at 32 kHz; STANDBY mode: 1.0 µA with 32-kHz 16-bit timer running, full SRAM/register retention, 3.2 µs wake-up time from 32 MHz clock; SHUTDOWN mode: 61 nA with IO wake-up support
  • 3-channel DMA controller
  • 3-channel event signaling system
  • 4× 16-bit general-purpose timers, each with 2 capture/compare registers, low-power operation in STANDBY mode, 8 PWM channels total
  • Window watchdog timer
  • 2× UART, 1× supports LIN, IrDA, DALI, Smart Card, Manchester; both support low-power operation in STANDBY mode
  • 2× I2C, 1× supports FM+ (1 Mbit/s); both support SMBus, PMBus, and STOP mode wake-up
  • 1× SPI, up to 16 Mbit/s
  • Internal 4–32 MHz oscillator, ±1.2% accuracy (SYSOSC)
  • Internal 32-kHz low-frequency oscillator, ±3% accuracy (LFOSC)
  • CRC support (CRC-16 or CRC-32)
  • Up to 28 GPIOs
  • 2× 5 V-tolerant open-drain I/Os with fail-safe protection
  • 2-pin SWD debug interface
  • Package options: 32-pin VQFN (RHB), 32-pin VSSOP (DGS), 28-pin VSSOP (DGS), 24-pin VQFN (RGE), 20-pin VSSOP (DGS), 16-pin SOT (DYY), 16-pin WQFN (RTR)
  • LP-MSPM0L1306 LaunchPad™ development kit available
  • MSP Software Development Kit (SDK) available

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