SI7415DN-T1-E3

P-Channel 60 V (D-S) MOSFET in PowerPAK 1212-8 single-chip package. The PowerPAK 1212-8 is a derivative of the PowerPAK SO-8, utilizing the same packaging technology to maximize die area. The exposed bottom die attach pad provides a direct, low-resistance thermal path to the substrate on which the device is mounted, bringing the advantages of the PowerPAK SO-8 into a smaller package while delivering the same level of thermal performance. Its footprint is comparable to TSOP-6, more than 40% smaller than standard TSSOP-8, with more than twice the die capacity of standard TSOP-6, thermal performance an order of magnitude better than SO-8, and 20 times better than TSSOP-8. It fully utilizes the heat dissipation capability of any PC board heatsink, and compared to TSSOP-8, reduces junction temperature and improves die efficiency by approximately 20%. Single and dual PowerPAK 1212-8 share the same pin configuration as single and dual PowerPAK SO-8, and the low-profile height of 1.05 mm makes it suitable for space-constrained applications.

Applications

• Load Switch - Half-Bridge Motor Driver - High-Voltage Asynchronous Buck Converter

Key features

• Trench power MOSFET
• Fast switching
• RoHS compliant and halogen-free