MDD(Microdiode Semiconductor)
2N7002KN-Channel 60V 300mA 300mW Surface Mount SOT-23
From
₹2.32
25,99,250 in stock
VISHAYDatasheet (PDF)
SI7478DP-T1-E3
N-Channel 60V 20A 5.4W Surface Mount PowerPAKSO-8
PowerPAKSO-8ROHS CompliantDiscontinued
MOSFET N-CH 60V 20A PowerPAKSO-8
- Manufacturer
- VISHAY
- Manufacturer part #
- SI7478DP-T1-E3
- Store part #
- C506598
- Package / case
- PowerPAKSO-8
- Category
- Single FETs, MOSFETs
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
3 in stock
#C506598
Stock & price checked 2 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹481.84 | ₹481.84 |
| 10+ | ₹472.26 | ₹4,722.60 |
| 30+ | ₹465.87 | ₹13,976.10 |
| 100+ | ₹459.49 | ₹45,949.00 |
1 × ₹481.84
₹481.84
excl. GST
₹568.57 incl. 18% GST
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 3,000 per reel
SI7478DP-T1-E3
₹481.84 for 1 + GST
Specifications
- Operating Temperature
- -55℃~+150℃
- Drain to Source Voltage
- 60V
- Current - Continuous Drain(Id)
- 20A
- Pd - Power Dissipation
- 5.4W
- RDS(on)
- 7.5mΩ@10V
- Number
- 1 N-channel
- Gate Charge(Qg)
- 160nC@10V
- Vgs
- ±20V
- Gate Threshold Voltage (Vgs(th))
- 3V
- Type
- N-Channel
Packaging & compliance
- RoHS
- ROHS Compliant
- Lifecycle
- Discontinued
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 3,000 / Reel
- Sold per
- Piece
- Minimum order
- 1
- Unit weight
- 0.13 g
Overview
MOSFETs for switching applications are now available with die on resistances around 1 mΩ and with the capability to handle 85 A. PowerPAK is a new package technology that addresses these issues. The PowerPAK SO - 8 utilizes the same footprint and the same pin - outs as the standard SO - 8. This allows PowerPAK to be substituted directly for a standard SO - 8 package. Being a leadless package, PowerPAK SO - 8 utilizes the entire SO - 8 footprint, freeing space normally occupied by the leads, and thus allowing it to hold a larger die than a standard SO - 8. The bottom of the die attach pad is exposed for the purpose of providing a direct, low resistance thermal path to the substrate the device is mounted on. The package height is lower than the standard SO - 8, making it an excellent choice for applications with space constraints.
Key features
- Halogen - free According to IEC 61249 - 2 - 21 Available
- TrenchFET Power MOSFET
- New Low Thermal Resistance PowerPAK Package with Low 1.07 mm Profile
- 100% Rg Tested
- RoHS COMPLIANT HALOGEN FREE Available
Alternatives
Similar parts — check the datasheet before substituting.
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