SI7658ADP-T1-GE3

MOSFETs for switching applications are now available with die on resistances around 1 mΩ and with the capability to handle 85 A. PowerPAK is a new package technology that addresses these issues. The PowerPAK SO - 8 utilizes the same footprint and the same pin - outs as the standard SO - 8. This allows PowerPAK to be substituted directly for a standard SO - 8 package. Being a leadless package, PowerPAK SO - 8 utilizes the entire SO - 8 footprint, freeing space normally occupied by the leads, and thus allowing it to hold a larger die than a standard SO - 8. The bottom of the die attach pad is exposed for the purpose of providing a direct, low resistance thermal path to the substrate the device is mounted on. The package height is lower than the standard SO - 8, making it an excellent choice for applications with space constraints. The PowerPAK single is simple to use. The pin arrangement (drain, source, gate pins) and the pin dimensions are the same as standard SO - 8 devices. Therefore, the PowerPAK connection pads match directly to those of the SO - 8. The only difference is the extended drain connection area. The PowerPAK SO - 8 dual has the same pin arrangement (drain, source, gate pins) and pin dimensions as standard SO - 8 dual devices. So, the PowerPAK device connection pads match.

Applications

• Low-side switch for DC/DC converters
• Servers
• Point-of-Load (POL)
• Voltage Regulator Module (VRM)
• OR-ing

Key features

• TrenchFET Gen III power MOSFET
• 100 % Rg tested
• 100 % avalanche tested
• RoHS COMPLIANT
• HALOGEN FREE