Varnitronics
SI8487DB-T1-E1 VISHAY
VISHAY

SI8487DB-T1-E1

P-Channel 30V 4.9A 1.1W Surface Mount UFBGA-4

UFBGA-4ROHS3 CompliantActive

MOSFET P-CH 30V 4.9A UFBGA-4

Manufacturer
VISHAY
Manufacturer part #
SI8487DB-T1-E1
Store part #
C727392
Package / case
UFBGA-4
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

4,758 in stock

#C727392

Stock & price checked 10 days ago

QuantityUnit pricePack price
1+₹44.74₹44.74
500+₹39.53₹19,765.00

1 × ₹44.74

₹44.74

excl. GST

₹52.79 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 3,000 per reel

SI8487DB-T1-E1

₹44.74 for 1 + GST

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Specifications

Output Capacitance(Coss)
200pF
Ciss-Input Capacitance
4.48nF
Pd - Power Dissipation
1.1W
Operating Temperature
-55℃~+150℃
Drain to Source Voltage
30V
Current - Continuous Drain(Id)
4.9A
Reverse Transfer Capacitance (Crss)
330pF
RDS(on)
31mΩ@10V
Number
1 P-Channel
Gate Charge(Qg)
52nC@10V
Vgs
±12V
Gate Threshold Voltage (Vgs(th))
600mV
Type
P-Channel

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
3,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.056 g

Overview

Vishay Siliconix’s MICRO FOOT product family is based on a wafer-level chip-scale packaging (WL-CSP) technology that implements a solder bump process to eliminate the need for an outer package to encase the silicon die. MICRO FOOT products include power MOSFETs, analog switches, and power ICs. For battery powered compact devices, this new packaging technology reduces board space requirements, improves thermal performance, and mitigates the parasitic effect typical of leaded packaged products. Vishay Siliconix MICRO FOOT products can be handled with the same process techniques used for high-volume assembly of packaged surface-mount devices. With proper attention to PCB and stencil design, the device will achieve reliable performance without underfill. The advantage of the device’s small footprint and short thermal path make it an ideal option for space-constrained applications in portable devices such as battery packs, PDAs, cellular phones, and notebook computers.

Applications

  • Mobile computing, smart phones, tablet PCs
  • Load switch
  • Battery switch
  • Charger switch
  • OVP switch

Key features

  • TrenchFET® power MOSFET
  • Low-on resistance
  • Ultra-small 1.6 mm x 1.6 mm maximum outline COMPLIANT
  • Ultra-thin 0.6 mm maximum height HALOGEN
  • Pin compatible to Si8409DB

Alternatives

Similar parts — check the datasheet before substituting.

SI8409DB-T1-E1#C727697VISHAY · XFBGA-4₹167.81 · 0 in stockView

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