MDD(Microdiode Semiconductor)
2N7002KN-Channel 60V 300mA 300mW Surface Mount SOT-23
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VISHAYDatasheet (PDF)
SIS407DN-T1-GE3
P-Channel 20V 25A 3.6W Surface Mount PowerPAK1212-8
PowerPAK1212-8ROHS3 CompliantActive
MOSFET P-CH 20V 25A PowerPAK1212-8
- Manufacturer
- VISHAY
- Manufacturer part #
- SIS407DN-T1-GE3
- Store part #
- C506608
- Package / case
- PowerPAK1212-8
- Category
- Single FETs, MOSFETs
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
6,293 in stock
#C506608
Stock & price checked 9 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹90.16 | ₹90.16 |
| 10+ | ₹72.74 | ₹727.40 |
| 30+ | ₹63.81 | ₹1,914.30 |
| 100+ | ₹55.10 | ₹5,510.00 |
| 500+ | ₹49.88 | ₹24,940.00 |
| 1,000+ | ₹47.26 | ₹47,260.00 |
1 × ₹90.16
₹90.16
excl. GST
₹106.39 incl. 18% GST
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 3,000 per reel
SIS407DN-T1-GE3
₹90.16 for 1 + GST
Specifications
- Output Capacitance(Coss)
- 405pF
- Ciss-Input Capacitance
- 2.76nF
- Pd - Power Dissipation
- 3.6W
- Operating Temperature
- -55℃~+150℃
- Drain to Source Voltage
- 20V
- Current - Continuous Drain(Id)
- 25A
- Reverse Transfer Capacitance (Crss)
- 370pF
- RDS(on)
- 9.5mΩ@4.5V
- Number
- 1 P-Channel
- Gate Charge(Qg)
- 38nC@4.5V
- Vgs
- ±8V
- Gate Threshold Voltage (Vgs(th))
- 400mV
- Type
- P-Channel
Packaging & compliance
- RoHS
- ROHS3 Compliant
- Lifecycle
- Active
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 3,000 / Reel
- Sold per
- Piece
- Minimum order
- 1
- Unit weight
- 0.065 g
Overview
P-Channel 20 V (D-S) MOSFET. The PowerPAK 1212-8 is a derivative of the PowerPAK SO-8, utilizing the same packaging technology to maximize die area. The exposed die attach pad on the bottom provides a direct, low-resistance thermal path to the substrate on which the device is mounted. Its package footprint is more than 40% smaller than a standard TSSOP-8, die capacity is more than twice that of a standard TSOP-6, thermal performance is an order of magnitude better than SO-8, and 20x better than TSSOP-8. It can leverage any PC board heatsinking capability, and compared to TSSOP-8, enables lower junction temperatures and approximately 20% improvement in die efficiency. Both single and dual versions share the same pinout as single and dual PowerPAK SO-8, and the low profile of 1.05 mm makes it suitable for space-constrained applications.
Applications
- Load switch
- Battery switch
Key features
- TrenchFET power MOSFET
- Low thermal resistance PowerPAK package with small size and low 1.07 mm profile
- 100 % Rg and UIS tested
Alternatives
Similar parts — check the datasheet before substituting.
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|---|---|---|---|---|---|---|
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