Varnitronics
SIS412DN-T1-GE3 VISHAY
VISHAY

SIS412DN-T1-GE3

N-Channel 30V 12A 15.6W Surface Mount PowerPAK1212-8

PowerPAK1212-8ROHS3 CompliantActive

MOSFET N-CH 30V 12A PowerPAK1212-8

Manufacturer
VISHAY
Manufacturer part #
SIS412DN-T1-GE3
Store part #
C111309
Package / case
PowerPAK1212-8
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

16,740 in stock

#C111309

Stock & price checked 8 days ago

QuantityUnit pricePack price
5+₹37.48₹187.40
50+₹29.56₹1,478.00
150+₹26.16₹3,924.00
500+₹21.92₹10,960.00
3,000+₹20.03₹60,090.00
6,000+₹18.91₹1,13,460.00

5 × ₹37.48

₹187.40

excl. GST

₹221.13 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 3,000 per reel

SIS412DN-T1-GE3

₹187.40 for 5 + GST

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Specifications

Operating Temperature
-55℃~+150℃
Drain to Source Voltage
30V
Output Capacitance(Coss)
95pF
Current - Continuous Drain(Id)
12A
Ciss-Input Capacitance
435pF
Pd - Power Dissipation
15.6W
Reverse Transfer Capacitance (Crss)
42pF
RDS(on)
30mΩ@4.5V
Number
1 N-channel
Gate Charge(Qg)
6nC@10V
Gate Threshold Voltage (Vgs(th))
2.5V
Type
N-Channel

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
3,000 / Reel
Sold per
Piece
Minimum order
5 (multiples of 5)
Unit weight
0.176 g

Overview

N-Channel 30V (D-S) MOSFET. The PowerPAK 1212-8 is derived from the PowerPAK SO-8, sharing the same packaging technology to maximize die area. The exposed die attach pad on the bottom provides a direct, low-resistance thermal path to the substrate on which the device is mounted, bringing the advantages of the PowerPAK SO-8 into a smaller package with the same level of thermal performance. Its footprint is comparable to TSOP-6 — more than 40% smaller than standard TSSOP-8 — while offering more than twice the die capacity of standard TSOP-6. Thermal performance is an order of magnitude better than SO-8 and 20× better than TSSOP-8, with the ability to leverage any PC board heat spreader. Compared to TSSOP-8, it enables approximately 20% lower junction temperature and improved die efficiency. Single and dual PowerPAK 1212-8 share the same pin configuration as single and dual PowerPAK SO-8. The low profile of 1.05mm makes it ideal for space-constrained applications.

Applications

  • Notebook PC - System Power - Load Switch

Key features

  • Halogen-free per IEC 61249-2-21
  • TrenchFET power MOSFET
  • 100% Rg tested

Alternatives

Similar parts — check the datasheet before substituting.

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