SMF13A

The SMF series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. SMF package is 50% smaller in footprint when compare to SMA package and deliverying one of the low height profiles (1.1 mm) in the industry.

Applications

• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones
• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in portable devices
• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in business machines
• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in power supplies
• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in other consumer applications

Key features

• 200W peak pulse power capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01%
• Compatible with industrial standard package SOD - 123FL
• Low profile: maximum height of 1.1mm
• Low inductance, excellent clamping capability
• For surface mounted applications to optimize board space
• High temperature to reflow soldering guaranteed: 260°C/40sec
• Typical failure mode is short from over - specified voltage or current
• Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
• IEC - 61000 - 4 - 2 ESD 30kV (Air), 30kV (Contact)
• ESD protection of data lines in accordance with IEC 61000 - 4 - 2
• EFT protection of data lines in accordance with IEC 61000 - 4 - 4
• Fast response time: typically less than 1.0ns from 0 Volts to VBR min
• Glass passivated junction
• Built - in strain relief
• Plastic package is flammability rated V - 0 per Underwriters Laboratories
• Meet MSL level1, per J - STD - 020, LF maximun peak of 260°C
• Matte tin lead–free plated
• Halogen - free and RoHS compliant
• Pb - free E3 means 2nd level interconnect is Pb - free and the terminal finish material is tin(Sn) (IPC/ JEDEC J - STD609A.01)