SMF5.0A

The SMF series is designed specifcally to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. This SMF package has a 50 % smaller footprint as compared to the SMA package and delivers one of the lowest height profles (1.1 mm) available in the industry.

Applications

• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in cellular phones
• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in portable devices
• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in business machines
• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in power supplies
• Protection of I/O interfaces, VCC bus and other vulnerable circuit used in other consumer applications

Key features

• Compatible with industrial standard package SOD-123FL
• Optimized surface mount footprint for minimal PCB space impact
• Low profle: maximum height of 1.1 mm
• Low inductance, excellen clamping capability
• Compatible with high temperature refow soldering (260°C/40sec)
• Typical failure mode due to exceeding maximum ratings is a short circuit condition
• Whisker test conducted based on Table 4a and 4c of JEDEC JESD201A
• IEC-61000-4-2 ESD 30kV (Air), 30 kV (Contact)
• EFT protection of data lines in accordance with IEC 61000-4-4
• 200 W peak pulse power capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01 %
• Fast response time: typically less than 1.0ns from 0 Volts to VBR min
• Glass passivated junction
• Built-in strain relief
• UL Recognized epoxy meeting fammability classifcation V-0
• Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
• Matte tin lead–free plated
• Halogen-free and RoHS compliant
• Pb-free E3 means 2nd level interconnect is Pb-free and the terminal fnish material is tin(Sn) (IPC/ JEDEC J-STD609A.01)