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LM358DR2G40mA 2 7mV 70dB 45nA 700uA SOIC-8 Instrumentation, Op Amps, Buffer Amps RoHS
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5,10,620 in stock

4 1.1mV 30V/ms 88dB 0.6pA 24uA 85kHz Rail-to-rail input SOIC-14 Instrumentation, Op Amps, Buffer Amps RoHS
LinCMOS low-voltage and low-power operational amplifier
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100% Authentic · 30-Day Return or Replacement · policy
165 in stock
#C18530
Stock & price checked 3 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹313.84 | ₹313.84 |
| 10+ | ₹266.35 | ₹2,663.50 |
| 30+ | ₹236.58 | ₹7,097.40 |
| 100+ | ₹206.16 | ₹20,616.00 |
| 500+ | ₹192.38 | ₹96,190.00 |
| 1,000+ | ₹186.46 | ₹1,86,460.00 |
1 × ₹313.84
₹313.84
excl. GST
₹370.33 incl. 18% GST
TLV2324IDR
₹313.84 for 1 + GST
The TLV232x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. This amplifier is especially well suited to ultra-low-power systems that require devices to consume the absolute minimum of supply currents. Each amplifier is fully functional down to a minimum supply voltage of 2 V; is fully characterized, tested, and specified at both 3-V and 5-V power supplies. The common-mode input voltage range includes the negative rail and extends to within 1 V of the positive rail. These amplifiers are specifically targeted for use in very low-power, portable, battery-driven applications with the maximum supply current per operational amplifier specified at only 27 μA over its full temperature range of -40°C to 85°C. Low-voltage and low-power operation has been made possible by using the silicon-gate LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications. To facilitate the design of small portable equipment, the TLV232x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline packages (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical. The device inputs and outputs are designed to withstand –100-mA currents without sustaining latch-up. The TLV232x incorporates internal ESD-protection circuits that prevent functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD can result in the degradation of the device parametric performance.
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