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2 600uV 380V/ms 92dB 0.6pA 160uA 300kHz Rail-to-Rail Input, Rail-to-Rail Output TSSOP-8 Instrumentation, Op Amps, Buffer Amps RoHS
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10 in stock
#C2058232
Stock & price checked 8 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹256.83 | ₹256.83 |
| 10+ | ₹250.19 | ₹2,501.90 |
| 30+ | ₹245.91 | ₹7,377.30 |
| 100+ | ₹241.41 | ₹24,141.00 |
1 × ₹256.83
₹256.83
excl. GST
₹303.06 incl. 18% GST
TLV2332IPWR
₹256.83 for 1 + GST
The TLV233x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. Unlike the TLV2322 which is optimized for ultra-low power, the TLV233x is designed to provide a combination of low power and good ac performance. Each amplifier is fully functional down to a minimum supply voltage of 2 V, is fully characterized, tested, and specified at both 3-V and 5-V power supplies. The common-mode input-voltage range includes the negative rail and extends to within 1 V of the positive rail. Having a maximum supply current of only 310 μA per amplifier over full temperature range, the TLV233x devices offer a combination of good ac performance and microampere supply currents. From a 3-V power supply, the amplifier’s typical slew rate is 0.38 V/μs and its bandwidth is 300 kHz. These amplifiers offer a level of ac performance greater than that of many other devices operating at comparable power levels. The TLV233x operational amplifiers are especially well suited for use in low-current or battery-powered applications. Low-voltage and low-power operation has been made possible by using the silicon-gate LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications. To facilitate the design of small portable equipment, the TLV233x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline package (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical. The device inputs and outputs are designed to withstand –100-mA currents without sustaining latch-up. The TLV233x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in the degradation of the device parametric performance.
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