Varnitronics
RENESAS

AT25DF021A-XMHN-T

2Mbit 1.65V~3.6V 104MHz SPI Memory RoHS

-ROHS3 CompliantActive

SPI Interface Flash Memory Chip Performance

Manufacturer
RENESAS
Manufacturer part #
AT25DF021A-XMHN-T
Store part #
C21230038
Package / case
-
Category
Memory
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

10 in stock

#C21230038

Stock & price checked 37 h ago

QuantityUnit pricePack price
1+₹300.35₹300.35
10+₹293.73₹2,937.30
30+₹289.25₹8,677.50
100+₹284.78₹28,478.00

1 × ₹300.35

₹300.35

excl. GST

₹354.41 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 4,000 per reel

AT25DF021A-XMHN-T

₹300.35 for 1 + GST

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Specifications

Operating Temperature
-40℃~+85℃
Features
Write enable latch;Hardware write protection;Software write protection
Memory Size
2Mbit
Voltage - Supply
1.65V~3.6V
Program / Erase Cycles
100,000 cycles
Clock Frequency
104MHz
Data Retention - TDR (Year)
20 Years
Standby Supply Current
25uA
Interface
SPI

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
4,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
1 g

Overview

Key features

  • Single 1.65 V - 3.6 V Supply (-40℃ to +85℃)
  • Single 1.7 V - 3.6 V Supply (-40℃ to +125℃)
  • Serial Peripheral Interface (SPI) Compatible
  • Supports SPI Modes 0 and 3
  • Supports Dual I/O Operation
  • 104 MHz Maximum Operating Frequency
  • Clock-to-Output (tCO) of 6 ns
  • Flexible, Optimized Erase Architecture for Code + Data Storage Application
  • Small (256 Byte) Page Erase
  • Uniform 4-kByte Block Erase
  • Uniform 32-kByte Block Erase
  • Uniform 64-kByte Block Erase
  • Full Chip Erase
  • Hardware Controlled Locking of Protected Sectors through WP Pin
  • 128-Byte Programmable One-Time Programmable (OTP) Security Register
  • 64 Bytes factory programmed with a unique identifier
  • 64 Bytes user programmable
  • Flexible Programming
  • Byte/Page Program (1 to 256 Bytes)
  • Dual-Input Byte/Page Program (1 to 256 Bytes)
  • Sequential Program Mode Capability
  • Fast Program and Erase Times
  • 1.25 ms Typical Page Program (256 Bytes) Time
  • 40 ms Typical 4-kByte Block Erase Time
  • 250 ms Typical 32-kByte Block Erase Time
  • 500 ms Typical 64-kByte Block Erase Time
  • Automatic Checking and Reporting of Erase/Program Failures
  • Software Controlled Reset
  • JEDEC Standard Manufacturer and Device ID Read Methodology
  • Low Power Dissipation
  • 200 nA Ultra Deep Power Down current (Typical)
  • 4.5 μA Deep Power-Down Current (Typical)
  • 25 μA Standby current (Typical)
  • 4.5 mA Active Read Current (Typical)
  • Endurance:
  • 100,000 Program/Erase Cycles (-40℃ to +85℃)
  • 20,000 Program/Erase Cycles (-40℃ to +125℃)
  • Data Retention: 20 Years
  • Complies with Full Industrial Temperature Range
  • Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
  • 8-lead SOIC (150-mil)
  • 8-pad Ultra Thin DFN (2x3x0.6 mm)
  • 8-pad Ultra Thin DFN (5x6x0.6 mm)
  • 8-lead TSSOP
  • 8-ball WLCSP (3x2x3 ball matrix)

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