AT25FF161A-SSHL-T

Key features

• Voltage range: 1.65 V - 3.75 V
• 16 Mbit (2M x 8) Flash memory
• SPI compatible
• Supports SPI Modes 0 and 3
• Supports single I/O operation (1-1-1)
• Supports dual output operation (1-1-2)
• Supports quad output operation (1-1-4)
• Supports quad I/O operation (1-4-4)
• Supports XiP operation (1-4-4, 0-4-4)
• Maximum operating frequency 133 MHz
• Clock-to-output time 8 ns
• Flexible, optimized erase architecture for code and data storage applications
• Uniform 4-kByte sector erase
• Uniform 32-kByte block erase
• Uniform 64-kByte block erase
• Chip erase
• Flexible non-volatile block protection
• 1 factory-programmed 128-byte unique identifier
• 3 x 128-byte OTP security registers
• Flexible programming
• Byte/page programming (1 to 256 bytes)
• Sequential programming mode capability
• Erase/program suspend and resume
• Software-controlled reset and abort commands
• Hardware reset option (via HOLD̄ pin)
• JEDEC hardware reset
• Non-volatile status register configuration options
• JEDEC standard manufacturer and device ID read method
• Serial Flash Discoverable Parameters (SFDP) version 1.6
• Low power at 1.65 V to 3.6 V:
• Typical standby current 30 μA
• Typical Deep Power-Down (DPD) current 8.2 μA
• Typical Ultra-Deep Power-Down (UDPD) current 5 - 7 nA
• Typical active read current 8.3 mA (1-1-1 — 108 MHz)
• Program current 10.1 mA
• Erase current 10.7 mA
• User-configurable and auto I/O pin drive levels
• Endurance:
• 100,000 program/erase cycles
• 10,000 cycles at -40°C to +105°C
• Data retention:
• 20 years
• 10 years at -40°C to +105°C
• Temperature range:
• -40°C to +85°C
• -40°C to +105°C
• Industry-standard green (Pb-free/halogen-free/RoHS compliant) package options:
• 8-pin SOIC (150 mil)
• 8-pin SOIC (208 mil)
• 8-pad WDFN (5 x 6 x 0.8 mm)
• 8-pad ultra-thin DFN (2 x 3 x 0.6 mm)
• 8-ball WLCSP (3 x 2 x 3 ball matrix)
• Die wafer form (DWF)