Varnitronics
Nexperia

BUK7S2R0-40HJ

40V 190A 183W 2mΩ@10V 1 N-channel N-Channel LFPAK-56 Single FETs, MOSFETs RoHS

LFPAK-56ROHS3 CompliantActive

MOSFET N-CH 40V 190A LFPAK-56

Manufacturer
Nexperia
Manufacturer part #
BUK7S2R0-40HJ
Store part #
C6136026
Package / case
LFPAK-56
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

78 in stock

#C6136026

Stock & price checked 5 days ago

QuantityUnit pricePack price
1+₹493.24₹493.24
10+₹481.29₹4,812.90
30+₹473.26₹14,197.80
100+₹465.23₹46,523.00

1 × ₹493.24

₹493.24

excl. GST

₹582.02 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 2,000 per reel

BUK7S2R0-40HJ

₹493.24 for 1 + GST

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Specifications

Operating Temperature
-55℃~+175℃
Drain to Source Voltage
40V
Output Capacitance(Coss)
950pF
Current - Continuous Drain(Id)
190A
Ciss-Input Capacitance
5.075nF
Pd - Power Dissipation
183W
Reverse Transfer Capacitance (Crss)
343pF
RDS(on)
2mΩ@10V
Number
1 N-channel
Gate Charge(Qg)
70nC@10V
Gate Threshold Voltage (Vgs(th))
3V
Type
N-Channel

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
2,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.175 g

Overview

Automotive-grade N-channel MOSFET utilizing the latest Trench 9 low-ohmic superjunction technology, housed in a copper-clip LFPAK88 package. Fully designed and qualified to meet AEC-Q101 requirements, with high performance and high reliability.

Applications

  • 12 V automotive systems
  • 48 V DC/DC systems (12 V secondary side)
  • Higher-power motor, lamp, and solenoid control
  • Reverse polarity protection
  • Ultra-high-performance power switching

Key features

  • Operating temperature range: -55°C to +175°C, suitable for high thermal dissipation environments
  • Smaller footprint and higher power density compared to legacy wire-bond packages such as D2PAK, ideal for today's space-constrained high-power automotive applications
  • Thin package and copper clip enable efficient thermal dissipation in LFPAK88
  • Enhanced maximum current capability with excellent current distribution
  • Improved on-state resistance RDS(on)
  • Low source inductance
  • Low thermal resistance Rth
  • Flexible leads absorb mechanical and thermal cycling stress for high board-level reliability, unlike conventional QFN packages
  • Visual (AOI) solder inspection capability — no expensive X-ray equipment required
  • Easy soldering with reliable mechanical solder joints
  • Reduced cell pitch and superjunction platform lower RDS(on) within the same footprint
  • Improved safe operating area (SOA) and avalanche capability compared to standard trench MOS
  • Narrow gate-source threshold voltage VGS(th) range for easy MOSFET paralleling

Alternatives

Similar parts — check the datasheet before substituting.

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