Varnitronics
BUK7S2R5-40HJ Nexperia
Nexperia

BUK7S2R5-40HJ

40V 140A 135W 2.16mΩ@10V 1 N-channel N-Channel LFPAK-88 Single FETs, MOSFETs RoHS

LFPAK-88ROHS3 CompliantActive

MOSFET N-CH 40V 140A LFPAK-88

Manufacturer
Nexperia
Manufacturer part #
BUK7S2R5-40HJ
Store part #
C6521328
Package / case
LFPAK-88
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

40 in stock

#C6521328

Stock & price checked 4 days ago

QuantityUnit pricePack price
1+₹166.92₹166.92
10+₹163.01₹1,630.10
30+₹160.19₹4,805.70
100+₹157.58₹15,758.00

1 × ₹166.92

₹166.92

excl. GST

₹196.97 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 2,000 per reel

BUK7S2R5-40HJ

₹166.92 for 1 + GST

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Specifications

Operating Temperature
-55℃~+175℃
Drain to Source Voltage
40V
Output Capacitance(Coss)
729pF
Current - Continuous Drain(Id)
140A
Ciss-Input Capacitance
2.709nF
Pd - Power Dissipation
135W
Reverse Transfer Capacitance (Crss)
127pF
RDS(on)
2.16mΩ@10V
Number
1 N-channel
Gate Charge(Qg)
38nC@10V
Gate Threshold Voltage (Vgs(th))
3V
Type
N-Channel

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
2,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.634 g

Overview

Automotive-grade N-channel MOSFET utilizing the latest Trench 9 low-ohmic superjunction technology, housed in a copper-clip LFPAK88 package. Fully designed and qualified to meet and exceed AEC-Q101 requirements, delivering high performance and high reliability.

Applications

  • 12 V automotive systems
  • 48 V DC/DC systems (12 V secondary side)
  • Higher-power motor, lamp, and solenoid control
  • Reverse polarity protection
  • Ultra-high-performance power switching

Key features

  • Rated temperature range of -55 °C to +175 °C, suitable for high thermal dissipation environments
  • LFPAK88 package:
  • Designed for today's space-constrained high-power automotive applications, offering a smaller footprint and higher power density compared to legacy wire-bond packages such as D2PAK
  • Thin package and copper clip enable efficient thermal dissipation in LFPAK88
  • LFPAK copper clip technology improvements over wire-bond packages:
  • Enhanced maximum current carrying capability and superior current distribution
  • Improved R\textDSon
  • Low source inductance
  • Low thermal resistance Rth
  • LFPAK gull-wing leads:
  • Flexible leads absorb mechanical and thermal cycling stress for high board-level reliability, unlike conventional QFN packages
  • Visual (AOI) solder inspection without costly X-ray equipment
  • Easy solder wetting for reliable mechanical solder joints
  • Unique 40 V Trench 9 super-junction technology:
  • Reduced cell pitch and super-junction mesa enable lower R\textDSon in the same die size
  • Improved safe operating area (SOA) and avalanche capability compared to standard trench MOS
  • Tight VGS(th) limits for easy MOSFET paralleling

Alternatives

Similar parts — check the datasheet before substituting.

PSMNR55-40SSHJ#C3278372Nexperia · LFPAK-88₹1,075.92 · 25 in stockView
PSMN1R2-55SLHAX#C6256105Nexperia · LFPAK-88₹1,216.68 · 9 in stockView
PSMNR90-50SLHAX#C5829405Nexperia · LFPAK-88₹922.38 · 0 in stockView

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