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TI

F28M35H22C1RFPT

ARM Cortex-M3 32 Bit HTQFP-144(20x20) Microcontrollers RoHS

HTQFP-144(20x20)ROHS3 CompliantActive

C2000™ dual-core 32-bit MCU with 250MIPS and 512KB flash memory

Manufacturer
TI
Manufacturer part #
F28M35H22C1RFPT
Store part #
C1344267
Package / case
HTQFP-144(20x20)
Packaging
Tray
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

3 in stock

#C1344267

Stock & price checked 4 days ago

QuantityUnit pricePack price
1+₹4,702.85₹4,702.85
30+₹4,444.30₹1,33,329.00

1 × ₹4,702.85

₹4,702.85

excl. GST

₹5,549.36 incl. 18% GST

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  • Standard pack: 60 per tray

F28M35H22C1RFPT

₹4,702.85 for 1 + GST

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Specifications

ADC (Bit)
12bit
Number of I/O
74
Operating Temperature
-40℃~+105℃@(TJ)
Voltage - Supply
1.2V;1.8V;3.3V
Program Memory Type
FLASH
Program Storage Size
256KB
CPU Core
ARM Cortex-M3
Core Size
32 Bit
CPU Maximum Speed
100MHz;150MHz

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
3A991A2
Packaging
Tray
Standard pack
60 / Tray
Sold per
Piece
Minimum order
1
Unit weight
0.001 g

Overview

The Concerto family is a multicore system-on-chip microcontroller unit (MCU) with independent communication and real-time control subsystems. The F28M35x family of devices is the first series in the Concerto family. The communications subsystem is based on the industry-standard 32-bit Arm Cortex-M3 CPU and features a wide variety of communication peripherals, including Ethernet 1588, USB OTG with PHY, Controller Area Network (CAN), UART, SSI, I2C, and an external interface. The real-time control subsystem is based on TI’s industry-leading proprietary 32-bit C28x floating-point CPU and features the most flexible and high-precision control peripherals, including ePWMs with fault protection, and encoders and captures—all as implemented by TI’s TMS320C2000™ Entry performance MCUs and Premium performance MCUs. In addition, the C28-CPU has been enhanced with the addition of the VCU instruction accelerator that implements efficient Viterbi, Complex Arithmetic, 16-bit FFTs, and CRC algorithms. A high-speed analog subsystem and supplementary RAM memory is shared, along with on-chip voltage regulation and redundant clocking circuitry. Safety considerations also include Error Correction Code (ECC), parity, and code secure memory, as well as documentation to assist with system-level industrial safety certification.

Applications

  • Automated sorting equipment
  • CNC control
  • Central inverter
  • String inverter
  • AC drive control module
  • Servo drive control module
  • AC-input BLDC motor drive
  • DC-input BLDC motor drive
  • Industrial AC-DC
  • Three phase UPS

Key features

  • Master Subsystem — Arm Cortex-M3
  • Up to 100 MHz
  • Embedded memory
  • Up to 512KB of flash (ECC)
  • Up to 32KB of RAM (ECC or parity)
  • Up to 64KB of shared RAM
  • 2KB of IPC Message RAM
  • Five Universal Asynchronous Receiver/ Transmitters (UARTs)
  • Four Synchronous Serial Interfaces (SSIs) and a Serial Peripheral Interface (SPI)
  • Two Inter-integrated Circuits (I2Cs)
  • Universal Serial Bus On-the-Go (USB-OTG) + PHY
  • 10/100 ENET 1588 MII
  • Two Controller Area Network, D_CAN, modules (pin-bootable)
  • 32-channel Micro Direct Memory Access (µDMA)
  • Dual security zones (128-bit password per zone)
  • External Peripheral Interface (EPI)
  • Micro Cyclic Redundancy Check (µCRC) module
  • Four general-purpose timers
  • Two watchdog timer modules
  • Three external interrupts
  • Endianness: little endian
  • Clocking
  • On-chip crystal oscillator and external clock input
  • Dynamic Phase-Locked Loop (PLL) ratio changes supported
  • 1.2-V digital, 1.8-V analog, 3.3-V I/O design
  • Interprocessor Communications (IPC)
  • 32 handshaking channels
  • Four channels generate IPC interrupts
  • Can be used to coordinate transfer of data through IPC Message RAMs
  • Up to 74 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins
  • Glitch-free I/Os
  • Control Subsystem — TMS320C28x 32-bit CPU
  • Up to 150 MHz
  • C28x core hardware built-in self-test
  • Embedded memory
  • Up to 512KB of flash (ECC)
  • Up to 36KB of RAM (ECC or parity)
  • Up to 64KB of shared RAM
  • 2KB of IPC Message RAM
  • IEEE-754 single-precision Floating-Point Unit (FPU)
  • Viterbi, Complex Math, CRC Unit (VCU)
  • Serial Communications Interface (SCI)
  • SPI
  • I2C
  • 6-channel Direct Memory Access (DMA)
  • Nine Enhanced Pulse Width Modulator (ePWM) modules
  • 18 outputs (16 high-resolution)
  • Six 32-bit Enhanced Capture (eCAP) modules
  • Three 32-bit Enhanced Quadrature Encoder Pulse (eQEP) modules
  • Multichannel Buffered Serial Port (McBSP)
  • EPI
  • One security zone (128-bit password)
  • Three 32-bit timers
  • Endianness: little endian
  • Analog Subsystem
  • Dual 12-bit Analog-to-Digital Converters (ADCs) Up to 2.88 MSPS
  • Up to 20 channels
  • Four Sample-and-Hold (S/H) circuits
  • Up to six comparators with 10-bit Digital-toAnalog Converter (DAC)
  • Package
  • 144-Pin RFP PowerPAD Thermally Enhanced Thin Quad Flatpack (HTQFP)
  • Temperature options:
  • T: -40℃ to 105℃ Junction
  • S: -40℃ to 125℃ Junction
  • Q: -40℃ to 125℃ Free-Air (AEC Q100 qualification for automotive applications)

Alternatives

Similar parts — check the datasheet before substituting.

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