Varnitronics
K4A8G085WC-BCTD SAMSUNG
SAMSUNG

K4A8G085WC-BCTD

8Gbit 1.333GHz DDR4 SDRAM FBGA-78 Memory RoHS

FBGA-78ROHS CompliantDiscontinued

DDR4 SDRAM

Manufacturer
SAMSUNG
Manufacturer part #
K4A8G085WC-BCTD
Store part #
C2920071
Package / case
FBGA-78
Category
Memory
Packaging
Tray
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

17 in stock

#C2920071

Stock & price checked 3 days ago

QuantityUnit pricePack price
1+₹7,801.82₹7,801.82

1 × ₹7,801.82

₹7,801.82

excl. GST

₹9,206.15 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 1,280 per tray

K4A8G085WC-BCTD

₹7,801.82 for 1 + GST

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Specifications

Operating Temperature
0℃~+95℃
Features
Auto precharge function;Asynchronous reset function;CRC function;ZQ calibration function;Dynamic on-chip termination;Data mask function
Refresh Current
4mA
Memory Size
8Gbit
Voltage - Supply
1.14V~1.26V;18mA
Clock Frequency
1.333GHz
Memory Format
DDR4 SDRAM

Packaging & compliance

RoHS
ROHS Compliant
Lifecycle
Discontinued
Packaging
Tray
Standard pack
1,280 / Tray
Sold per
Piece
Minimum order
1
Unit weight
2.56 g

Overview

Key features

  • JEDEC standard 1.2V (1.14V~1.26V)
  • VDDQ = 1.2V (1.14V~1.26V)
  • 800 MHz fCK for 1600Mb/sec/pin, 933 MHz fCK for 1866Mb/sec/pin, 1067MHz fCK for 2133Mb/sec/pin, 1200MHz fCK for 2400Mb/sec/pin, 1333MHz fCK for 2666Mb/sec/pin
  • 16 Banks (4 Bank Groups)
  • Programmable CAS Latency (posted CAS): 10,11,12,13,14,15,16,17,18,19,20
  • Programmable Additive Latency: 0, CL-2 or CL-1 clock
  • Programmable CAS Write Latency (CWL) = 9,11 (DDR4-1600), 10,12 (DDR4-1866),11,14 (DDR4-2133),12,16 (DDR4-2400) and 14,18 (DDR4-2666)
  • 8-bit pre-fetch
  • Burst Length: 8, 4 with fCCD = 4 which does not allow seamless read or write [either On the fly using A12 or MRS]
  • Bi-directional Differential Data-Strobe
  • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85℃, 3.9us at 85℃ < TCASE < 95℃
  • Connectivity Test Mode (TEN) is Supported
  • Asynchronous Reset
  • Package: 78 balls FBGA - ×4

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