Varnitronics
LMG3410R070RWHR TI
TI

LMG3410R070RWHR

Half-Bridge 1 MOSFET 15ns 4.2ns VQFN-32-EP(8x8) Power Distribution Switches, Load Drivers RoHS

VQFN-32-EP(8x8)ROHS3 CompliantActive

600V GaN power stage with integrated driver and protection functions

Manufacturer
TI
Manufacturer part #
LMG3410R070RWHR
Store part #
C2680280
Package / case
VQFN-32-EP(8x8)
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

50 in stock

#C2680280

Stock & price checked 3 days ago

QuantityUnit pricePack price
1+₹1,811.24₹1,811.24
10+₹1,722.39₹17,223.90
30+₹1,568.85₹47,065.50
100+₹1,434.70₹1,43,470.00

1 × ₹1,811.24

₹1,811.24

excl. GST

₹2,137.26 incl. 18% GST

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  • GST invoice with every order
  • Standard pack: 2,000 per reel

LMG3410R070RWHR

₹1,811.24 for 1 + GST

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Specifications

Input Logic Level - High
2.5V
Operating Temperature
-40℃~+125℃
Input Logic Level - Low
800mV
Driven Configuration
Half-Bridge
Propagation Delay tpHL
36ns
Features
Enable shutdown;Overcurrent Protection
number of channels
1
Load Type
MOSFET
Rise Time
15ns
Fall Time
4.2ns
Operating Voltage
9.5V~18V
Propagation Delay tpLH
20ns
Quiescent Current (Iq)
500uA

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
EAR99
Packaging
Tape & Reel (TR)
Standard pack
2,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.24 g

Overview

The LMG341xR070 GaN power stage features an integrated driver and protection functions, enabling designers to achieve a higher level of power density and efficiency in power electronics systems. The inherent advantages of the LMG341x surpass those of silicon MOSFETs, including ultra-low input and output capacitance values, zero reverse recovery that can reduce switching losses by 80%, and low switching node ringing that can reduce EMI. These advantages support dense and efficient topologies such as the totem-pole PFC. The LMG341xR070 offers an alternative to traditional cascode GaN and discrete GaN FETs by integrating a unique set of features to simplify the design, maximize reliability, and optimize the performance of any power supply. The integrated gate driver supports 100V/ns switching (with almost zero Vds ringing), a current limit of less than 100ns can prevent accidental breakdown events on its own, overheat shutdown can prevent thermal runaway, and system interface signals can provide self-monitoring capabilities.

Applications

  • High-density industrial and consumer power supplies
  • Multi-level converters
  • Photovoltaic inverters
  • Industrial motor drives
  • Uninterruptible power supplies
  • High-voltage battery chargers

Key features

  • TI GaN process qualified through real-application hard-switching mission profile reliability accelerated testing
  • High-density power conversion design support
  • Superior system performance vs. cascode or discrete GaN FETs
  • Low-inductance 8mm×8mm QFN package for simplified design and layout
  • Adjustable drive strength for switching performance and EMI control
  • Digital fault status output signal
  • +12V unregulated supply only
  • Integrated gate driver
  • Zero common-source inductance, 20ns propagation delay for MHz-range switching frequency
  • Process-tuned gate bias voltage for reliability assurance
  • User-adjustable slew rate from 25 to 100V/ns
  • Robust protection
  • No external protection components required
  • Overcurrent protection with response time <100ns
  • Slew rate immunity >150V/ns
  • Transient overvoltage immunity
  • Overtemperature protection
  • UVLO protection for all power rails

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