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R5F51135ADFP#3A RENESAS
RENESAS

R5F51135ADFP#3A

RX 32 Bit 32MHz LQFP-100(14x14) Microcontrollers RoHS

LQFP-100(14x14)ROHS3 CompliantActive

32-bit RX MCUs, USB 2.0 full-speed host/function/OTG, comms channels, serial sound interface, LCD controller/driver, capacitive touch sensing unit, 12-bit A/D, 12-bit D/A, RTC

Manufacturer
RENESAS
Manufacturer part #
R5F51135ADFP#3A
Store part #
C1341969
Package / case
LQFP-100(14x14)
Packaging
Tray
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

10 in stock

#C1341969

Stock & price checked 25 h ago

QuantityUnit pricePack price
1+₹936.84₹936.84
10+₹914.71₹9,147.10
30+₹900.10₹27,003.00
100+₹885.48₹88,548.00

1 × ₹936.84

₹936.84

excl. GST

₹1,105.47 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 90 per tray

R5F51135ADFP#3A

₹936.84 for 1 + GST

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Specifications

DAC (Bit)
12bit
ADC (Bit)
12bit
Number of I/O
82
Operating Temperature
-40℃~+85℃
Program Memory Type
FLASH
Voltage - Supply
1.8V~3.6V
Program Storage Size
128KB
EEPROM
8KB
CPU Core
RX
Core Size
32 Bit
CPU Maximum Speed
32MHz
Oscillator Type
Built-in

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
3A991A2
Packaging
Tray
Standard pack
90 / Tray
Sold per
Piece
Minimum order
1
Unit weight
10.71 g

Overview

Key features

  • 32-bit RX CPU core
  • 32 MHz maximum operating frequency Capable of 50 DMIPS when operating at 32 MHz
  • Accumulator handles 64-bit results (for a single instruction) from 32-bit × 32-bit operations Multiplication and division unit handles 32-bit × 32-bit operations (multiplication instructions take one CPU clock cycle)
  • Fast interrupt
  • CISC Harvard architecture with five-stage pipeline
  • Variable-length instruction format, ultra-compact code
  • On-chip debugging circuit
  • Low power consumption functions
  • Operation from a single 1.8 to 3.6 V supply
  • Three low power consumption modes
  • Low power timer (LPT) that operates during the software standby state Supply current High-speed operating mode: 0.11 mA/MHz Software standby mode: 0.44 μA Recovery time from software standby mode: 4.8 μs
  • On-chip flash memory for code, no wait states
  • Operation at 32 MHz, read cycle of 31.25 ns
  • No wait states for reading at full CPU speed
  • 128 to 512 Kbyte capacities
  • Programmable at 1.8 V
  • For instructions and operands
  • 8 Kbytes 1,000,000 Erase/Write cycles (typ.)
  • BGO (Background Operation)
  • On-chip SRAM, no wait states
  • 32 and 64 Kbyte capacities
  • Data transfer controller (DTC)
  • Four transfer modes
  • Transfer can be set for each interrupt source.
  • Event link controller (ELC)
  • Module operation can be initiated by event signals without going through interrupts. Link operation between modules is possible while the CPU is sleeping.
  • Reset and power supply voltage management
  • Six types including Power-On Reset (POR) Low voltage detection (LVD) with voltage settings
  • Clock functions
  • External clock input frequency: Up to 20 MHz
  • Main clock oscillator frequency: 1 to 20 MHz
  • Sub-clock oscillator frequency: 32.768 kHz
  • PLL circuit input: 4 to 8 MHz
  • Low-speed on-chip oscillator: 4 MHz
  • High-speed on-chip oscillator: 32 MHz ±1% (–20 to 85℃)
  • USB-dedicated PLL circuit: 6 and 8 MHz
  • IWDT-dedicated on-chip oscillator: 15 kHz
  • Generate a dedicated 32.768-kHz clock for the RTC
  • On-chip clock frequency accuracy measurement circuit (CAC)
  • Realtime clock (RTC)
  • 30-second, leap year, and error adjustment functions
  • Calendar count mode or binary count mode selectable
  • Capable of initiating exit from software standby mode
  • Independent watchdog timer (IWDT)
  • 15-kHz on-chip oscillator produces a dedicated clock signal to drive IWDT operation.
  • On-chip functions for IEC 60730 compliance Clock frequency accuracy measurement circuit, IWDT, functions to assist in RAM testing, etc.
  • Up to 12 channels for communication
  • USB: USB 2.0 host/function/On-The-Go (OTG) (one channel), fullspeed = 12 Mbps, low-speed = 1.5 Mbps, isochronous transfer, and BC (Battery Charger) supported
  • SCI: Asynchronous mode, clock synchronous mode, smart card interface (up to eight channels)
  • IrDA interface (one channel, in cooperation with SCI5)
  • I²C bus interface: Transfer at up to 400 kbps, capable of SMBus operation (one channel)
  • RSPI: Up to 16 Mbps (one channel)
  • Serial sound interface (SSI) (one channel)
  • Up to 14 extended-function timers
  • 16-bit MTU: Input capture/output compare, complementary PWM output, phase counting mode (six channels)
  • 8-bit TMR (four channels)
  • 16-bit CMT (four channels)
  • LCD controller/driver
  • Segment signal output × common signal output: 40 × 4, 36 × 8
  • On-chip voltage boost circuit, contrast adjustment, and 5-V panel supported
  • Blinking function
  • Capacitive touch sensing unit (CTSU)
  • Detection pins: 12 channels (for 100 pins only)
  • High-sensitive electrostatic capacitance detection using self-capacitance and mutual capacitance methods
  • On-chip noise canceller that enables high tolerance to disturbance noise
  • Also supports a mutual capacitance method that allows touch channels to be increased with low pin counts
  • Temperature sensor
  • General I/O ports
  • 5-V tolerant, open drain, input pull-up
  • Multi-function pin controller (MPC)
  • Multiple I/O pins can be selected for peripheral functions.
  • Unique ID
  • 32-byte ID code for the MCU
  • Operating temperature range
  • -40 to +85℃
  • -40 to +105℃

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