MDD(Microdiode Semiconductor)
2N7002KN-Channel 60V 300mA 300mW Surface Mount SOT-23
From
₹2.32
25,99,250 in stock
VISHAYDatasheet (PDF)
SIR158DP-T1-GE3
N-Channel 30V 60A 125W Surface Mount PowerPAK-SO-8
PowerPAK-SO-8ROHS3 CompliantActive
MOSFET N-CH 30V 60A PowerPAK-SO-8
- Manufacturer
- VISHAY
- Manufacturer part #
- SIR158DP-T1-GE3
- Store part #
- C142530
- Package / case
- PowerPAK-SO-8
- Category
- Single FETs, MOSFETs
- Packaging
- Tape & Reel (TR)
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement · policy
2,974 in stock
#C142530
Stock & price checked 13 days ago
| Quantity | Unit price | Pack price |
|---|---|---|
| 1+ | ₹175.50 | ₹175.50 |
| 10+ | ₹146.18 | ₹1,461.80 |
| 30+ | ₹130.10 | ₹3,903.00 |
| 100+ | ₹111.86 | ₹11,186.00 |
| 500+ | ₹103.83 | ₹51,915.00 |
| 1,000+ | ₹100.12 | ₹1,00,120.00 |
1 × ₹175.50
₹175.50
excl. GST
₹207.09 incl. 18% GST
- Dispatch in 15-18 working days
- GST invoice with every order
- Standard pack: 3,000 per reel
SIR158DP-T1-GE3
₹175.50 for 1 + GST
Specifications
- Operating Temperature
- -55℃~+150℃
- Drain to Source Voltage
- 30V
- Output Capacitance(Coss)
- 915pF
- Current - Continuous Drain(Id)
- 60A
- Ciss-Input Capacitance
- 4.98nF
- Pd - Power Dissipation
- 125W
- Reverse Transfer Capacitance (Crss)
- 495pF
- RDS(on)
- 2.3mΩ@4.5V
- Number
- 1 N-channel
- Gate Charge(Qg)
- 130nC@10V
- Gate Threshold Voltage (Vgs(th))
- 2.5V
- Type
- N-Channel
Packaging & compliance
- RoHS
- ROHS3 Compliant
- Lifecycle
- Active
- ECCN
- EAR99
- Packaging
- Tape & Reel (TR)
- Standard pack
- 3,000 / Reel
- Sold per
- Piece
- Minimum order
- 1
- Unit weight
- 0.131 g
Overview
The PowerPAK package was developed around the SO - 8 package. The PowerPAK SO - 8 utilizes the same footprint and the same pin - outs as the standard SO - 8. This allows PowerPAK to be substituted directly for a standard SO - 8 package. Being a leadless package, PowerPAK SO - 8 utilizes the entire SO - 8 footprint, freeing space normally occupied by the leads, and thus allowing it to hold a larger die than a standard SO - 8. The bottom of the die attach pad is exposed for the purpose of providing a direct, low resistance thermal path to the substrate the device is mounted on. Finally, the package height is lower than the standard SO - 8, making it an excellent choice for applications with space constraints.
Applications
- Low - side swi - Servers - POL - VRM
- OR - ing
Key features
- TrenchFET® gen III power MOSFET
- 100 % Rg and UIS tested
Alternatives
Similar parts — check the datasheet before substituting.
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|---|---|---|---|---|---|---|
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 | MSB002Y#C47361212MIRACLE POWER · PDFN-8L(5x6) | MIRACLE POWER | PDFN-8L(5x6) | 94 | ₹72.29 · 94 in stock | View |
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