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SPC582B50E1AD00X ST
ST

SPC582B50E1AD00X

Freescale Series 32 Bit 48MHz HTQFP-64(10x10) Microcontrollers RoHS

HTQFP-64(10x10)ROHS3 CompliantActive

32-bit Power Architecture automotive MCU

Manufacturer
ST
Manufacturer part #
SPC582B50E1AD00X
Store part #
C2055548
Package / case
HTQFP-64(10x10)
Packaging
Tape & Reel (TR)
Datasheet (PDF)

Every Order Guarantee

100% Authentic · 30-Day Return or Replacement · policy

5 in stock

#C2055548

Stock & price checked 25 h ago

QuantityUnit pricePack price
1+₹1,216.75₹1,216.75
10+₹1,188.21₹11,882.10
30+₹1,169.06₹35,071.80
100+₹1,150.10₹1,15,010.00

1 × ₹1,216.75

₹1,216.75

excl. GST

₹1,435.77 incl. 18% GST

Need volume or a scheduled delivery? Request a quote
  • Dispatch in 15-18 working days
  • GST invoice with every order
  • Standard pack: 1,000 per reel

SPC582B50E1AD00X

₹1,216.75 for 1 + GST

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Specifications

ADC (Bit)
12bit
Number of I/O
48
Operating Temperature
-40℃~+125℃
Voltage - Supply
3.3V;5V
Program Memory Type
FLASH
EEPROM
64KB
Program Storage Size
512KB
CPU Core
Freescale Series
Core Size
32 Bit
CPU Maximum Speed
48MHz
Oscillator Type
Built-in

Packaging & compliance

RoHS
ROHS3 Compliant
Lifecycle
Active
ECCN
3A991A2
Packaging
Tape & Reel (TR)
Standard pack
1,000 / Reel
Sold per
Piece
Minimum order
1
Unit weight
0.001 g

Overview

The SPC582Bx microcontroller is the entry member of a new family of devices superseding the SPC560Bx family. SPC582Bx is built on the legacy of the SPC5x products, while introducing new features to answer the future requirements like the ASIL-B classification, high number of ISO CAN-FD channels, and provide significant power and performance improvement (MIPS per mW).

Key features

  • AEC-Q100 qualified
  • High performance e200z2 single core – 32-bit Power Architecture technology
  • CPU Core frequency as high as 80 MHz
  • Variable Length Encoding (VLE) – Floating Point, End-to-End Error Correction
  • 1088 KB (1024 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
  • 96 KB on-chip general-purpose SRAM
  • Multi-channel direct memory access controller (eDMA) with 16 channels
  • 1 interrupt controller (INTC)
  • Comprehensive new generation ASIL-B safety concept – ASIL-B of ISO 26262
  • FCCU for collection and reaction to failure notifications
  • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
  • Cyclic redundancy check (CRC) unit
  • End-to-end Error Correction Code (e2eECC) logic
  • Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
  • Body cross triggering unit (BCTU) Triggers ADC conversions from any eMIOS channel
  • Triggers ADC conversions from up to 2 dedicated PIT_RTIs
  • 1 event configuration register dedicated to each timer event allows to define the corresponding ADC channel
  • Synchronization with ADC to avoid collision
  • 1 enhanced 12-bit SAR analog-to-digital converters – Up to 27 channels – enhanced diagnosis feature
  • Communication interfaces
  • 6 LINFlexD modules
  • 4 deserial serial peripheral interface (DSPI) modules
  • 7 MCAN interfaces with advanced shared memory scheme and ISO CAN FD support
  • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
  • Nexus Class 3 debug and trace interface
  • Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART.
  • Enhanced modular IO subsystem (eMIOS): up to 32 timed I/O channels with 16-bit counter resolution
  • Advanced and flexible supply scheme On-chip voltage regulator for 1.2V core logic supply.
  • Junction temperature range -40 ℃ to 150 ℃

Alternatives

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