SQSA80ENW-T1_GE3

MOSFETs for switching applications are now available with die on resistances around 1 mΩ and with the capability to handle 85 A. PowerPAK is a new package technology that addresses these issues. The PowerPAK 1212 - 8 provides ultra-low thermal impedance in a small package that is ideal for space-constrained applications. The PowerPAK 1212-8 package is a derivative of PowerPAK SO-8. It utilizes the same packaging technology, maximizing the die area. The bottom of the die attach pad is exposed to provide a direct, low resistance thermal path to the substrate the device is mounted on. The PowerPAK 1212-8 thus translates the benefits of the PowerPAK SO-8 into a smaller package, with the same level of thermal performance. It has a footprint area comparable to TSOP-6. It is over 40 % smaller than standard TSSOP-8. Its die capacity is more than twice the size of the standard TSOP-6’s. It has thermal performance an order of magnitude better than the SO-8, and 20 times better than TSSOP-8. It will take the advantage of any PC board heat sink capability. Bringing the junction temperature down also increases the die efficiency by around 20 % compared with TSSOP-8. For applications where bigger packages are typically required solely for thermal consideration, the PowerPAK 1212-8 is a good option. The low 1.05 mm PowerPAK height profile makes both versions an excellent choice for applications with space constraints.

Key features

• TrenchFET power MOSFET
• AEC-Q101 qualified
• 100 % Rg and UIS tested