STM32F400RBT6

The STM32F400XB device is based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at up to 100 MHz. The Cortex®-M4 core features a single-precision floating-point unit (FPU) supporting all Arm single-precision data-processing instructions and data types, along with a full set of DSP instructions and a memory protection unit (MPU). This device belongs to the STM32 Dynamic Efficiency™ product family, combining power efficiency, performance, and integration, with the addition of Batch Acquisition Mode (BAM) to further reduce power consumption during data batching. It integrates high-speed embedded memory with up to 128 Kbytes of Flash memory and up to 32 Kbytes of SRAM, plus an extensive range of enhanced I/Os and peripherals connected to two APB buses, one AHB bus, and a 32-bit multi-AHB bus matrix. It includes one 12-bit ADC, one 12-bit DAC, one low-power RTC, three general-purpose 16-bit timers, one PWM timer for motor control, one general-purpose 32-bit timer, one 16-bit low-power timer, and standard and advanced communication interfaces.

Applications

• Sensor hub
• Data batch processing scenarios
• Motor control applications
• Low-power embedded systems
• Communication interface integration devices
• High-precision measurement equipment
• Safety-critical applications (with MPU)
• Audio processing applications (I2S protocol support)
• Real-time data acquisition systems
• Battery-powered devices (low-power feature optimized)

Key features

• Dynamic Efficiency™ series with eBAM (Enhanced Batch Acquisition Mode)
• Supply voltage range: 1.7 V to 3.6 V
• Operating temperature range: -40℃ to 85℃
• Core: Arm® 32-bit Cortex®-M4 CPU (with FPU), Adaptive Real-Time Accelerator (ART Accelerator™), memory protection unit, up to 100 MHz, up to 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), DSP instruction set
• Memory: up to 128 KB Flash, 512-byte OTP, 32 KB SRAM
• Clock, reset and power management: 1.7 V to 3.6 V supply and I/O; POR, PDR, PVD and BOR; 4 to 26 MHz crystal oscillator; factory-trimmed internal 16 MHz RC oscillator; 32 kHz RTC oscillator with calibration; internal 32 kHz RC oscillator with calibration
• Power consumption: 89 μA/MHz in run mode (peripherals off); stop mode (Flash stop, fast wakeup): typical 40 μA@25℃, max 49 μA@25℃; stop mode (Flash deep power-down, slow wakeup): down to 6 μA@25℃, max 14 μA@25℃; standby mode: 2.4 μA@25℃/1.7 V (no RTC), 12 μA@85℃@1.7 V; 1 μA@25℃ with VBAT powering RTC
• 1× 12-bit 2.4 MSPS ADC (up to 16 channels)
• 1× 12-bit DAC
• General-purpose DMA: 16-channel DMA controller (with FIFO and burst support)
• Timers: up to 9, including 1 low-power timer (available in stop mode), 1× 16-bit advanced motor control timer, 3× 16-bit general-purpose timers, 1× 32-bit timer (up to 100 MHz, with 4 IC/OC/PWM or pulse counter and quadrature encoder inputs), 2 watchdog timers (independent and windowed), SysTick timer
• Debug: Serial Wire Debug (SWD) and JTAG; Cortex®-M4 Embedded Trace Macrocell™
• I/O: up to 50 with interrupt capability, including up to 45 fast I/Os (up to 100 MHz), up to 49 5 V-tolerant I/Os
• Communication interfaces: up to 9, including 3× I2C (SMBus/PMBus, 1× fast mode 1 MHz), 3× USART (2× 12.5 Mbit/s, 1× 6.25 Mbit/s, ISO7816, LIN, IrDA, modem control), 3× SPI/I2S (up to 50 Mbit/s SPI or I2S audio protocol)
• True random number generator
• CRC calculation unit
• 96-bit unique ID
• RTC: sub-second accuracy, hardware calendar
• All packages ECOPACK®2