TMS320F28376SZWTT

C2000 32-bit microcontrollers are optimized for processing, sensing, and driving to improve the closed-loop performance of real-time control applications such as industrial motor drives, photovoltaic inverters and digital power supplies, electric vehicles and transportation, motor control, and sensing and signal processing. The C2000 series includes high-performance MCUs and entry-level performance MCUs. TMS320F2837xS is a powerful 32-bit floating-point microcontroller unit (MCU) designed for advanced closed-loop control applications such as industrial motor drives, photovoltaic inverters and digital power supplies, electric vehicles and transportation, and sensing and signal processing. To accelerate application development, a DigitalPower software development kit (SDK) for C2000 MCUs and a MotorControl software development kit (SDK) for C2000 MCUs are provided. The real-time control subsystem is based on TI's 32-bit C28X floating-point CPU, providing 200MHz signal processing performance. The performance of the C28x CPU is further enhanced by the new TMU accelerator and VCU accelerator. The TMU accelerator can quickly execute algorithms for trigonometric operations common in transformation and torque loop calculations; the VCU accelerator can shorten the time for complex mathematical operations common in coding applications. The F2837xS microcontroller product family features a CLA real-time control coprocessor. The CLA is an independent 32-bit floating-point processor that runs at the same speed as the main CPU. The CLA responds to peripheral triggers and executes code simultaneously with the main C28x CPU. This parallel processing capability can effectively double the computational performance of real-time control systems. By using the CLA to serve time-critical functions, the main C28x CPU can freely perform other tasks such as communication and diagnosis. TMS320F2837xS supports up to 1MB (512KW) of on-board flash memory with error correction code (ECC) and up to 164KB (82KW) of SRAM. There are also two 128-bit security zones on the CPU for code protection. High-performance analog and control peripherals are also integrated on the F2837xS MCU to further enable system integration. Four independent 16-bit ADCs can accurately and efficiently manage multiple analog signals, ultimately improving system throughput. The new Σ-Δ filter module (SDFM) works with the Σ-Δ modulator to enable isolated current shunt measurements. A comparator subsystem (CMPSS) with window comparators allows protection of the power stage when current limit conditions are exceeded or not met. Other analog and control peripherals include DACs, PWMs, eCAPs, eQEPs, and other peripherals. Peripherals such as EMIF, CAN modules (compliant with ISO 11898-1/CAN 2.0B standards), and the new uPP interface extend the connectivity of F2837xS. The uPP interface is a new feature of C2000 MCUs, supporting high-speed parallel connections with FPGAs or other processors using similar uPP interfaces. Finally, a USB 2.0 port with MAC and PHY allows users to easily add Universal Serial Bus (USB) connectivity to their applications.

Applications

• Medium/short-range radar
• Traction inverter motor control
• HVAC large commercial motor control
• Automatic sorting equipment
• CNC control
• AC charging (pile) station
• DC charging (pile) station
• Electric vehicle charging station power module
• Energy storage power conversion system (PCS)
• Central inverter
• Solar power optimizer
• String inverter
• Inverter and motor control
• On-board charger (OBC) and wireless charger
• Linear motor segment controller
• Servo drive control module
• AC input BLDC motor driver
• DC input BLDC motor driver
• Industrial AC/DC power supply
• Three-phase UPS

Key features

• TMS320C28x 32-bit CPU– 200MHz IEEE 754 single-precision floating-point unit (FPU)
• Trigonometric function accelerator (TMU)
• Viterbi/complex math unit (VCU-II)
• Programmable control law accelerator (CLA)– 200MHz IEEE 754 single-precision floating-point instructions– Independent of the main CPU to execute code
• On-chip memory– 512KB (256KW) or 1MB (512KW) flash memory (ECC protection)
• 132KB (66KW) or 164KB (82KW) RAM (ECC protection or parity protection)
• Support for dual-zone security developed by third parties
• Unique identification number
• Clock and system control– Two internal zero-pin 10MHz oscillators
• On-chip crystal oscillator
• Window watchdog timer module
• Missing clock detection circuit
• 1.2V core, 3.3V I/O design– Two external memory interfaces (EMIF) supporting ASRAM and SDRAM
• 6-channel direct memory access (DMA) controller
• Up to 169 independent programmable, multiplexed general-purpose input/output (GPIO) pins with input filtering
• Extended peripheral interrupt controller (ePIE)
• Support for multiple low-power modes (LPM) with external wake-up function
• Communication peripherals– USB 2.0 (MAC + PHY)
• Support for 12-pin 3.3V compatible universal parallel port (uPP) interface
• Two controller area network (CAN) modules (pin-bootable)
• Three high-speed (up to 50MHz) SPI ports (pin-bootable)
• Two multi-channel buffered serial ports (McBSP)
• Four serial communication interfaces (SCI/UART) (pin-bootable)
• Two I2C interfaces (pin-bootable)
• Analog subsystem– Up to four analog-to-digital converters (ADC)
• Eight window comparators with 12-bit digital-to-analog converter (DAC) references
• Three 12-bit buffered DAC outputs
• Enhanced control peripherals– 24 PWM channels with enhanced features
• 16 high-resolution pulse width modulator (HRPWM) channels
• A and B channels of 8 PWM modules have high resolution
• Dead-time support (in both standard and high resolution)
• 6 enhanced capture (eCAP) modules
• 3 enhanced quadrature encoder pulse (eQEP) modules
• 8 Δ-Σ filter module (SDFM) input channels, with 2 parallel filters per channel
• Standard SDFM data filtering
• Comparator filter for fast response in case of out-of-range conditions
• Configurable logic block (CLB)
• Enhance existing peripheral functions
• Support Position Manager solution
• Function safety compliant– Developed for functional safety applications
• Documentation provided helps to make ISO 26262 system design compliant with ASIL D, IEC 61508 SIL 3, IEC 60730 Class C, and UL 1998 Class 2 standards
• Hardware integrity up to ASIL B and SIL 2 levels
• Safety-related certifications– Certified by TUV SUD, ISO 26262 certification up to ASIL B level and IEC 61508 certification up to SIL 2 level
• Lead-free, green packaging
• 337 solder ball new fine-pitch ball grid array (nFBGA) [suffix ZWT]
• 176-pin PowerPAD thermally enhanced low-profile quad flat package (HLQFP) [PTP suffix]
• 100-pin PowerPAD thermally enhanced thin quad flat package (HTQFP) [PZP suffix]
• Temperature options:– T: -40℃ to 105℃ junction temperature
• S: -40℃ to 125℃ junction temperature
• Q: -40℃ to 125℃ in natural ventilation (AEC Q100 qualified for automotive applications)