W632GU6RB-11

This device is a 16M×8 banks×16-bit DDR3L SDRAM operating at 1.35V (VDD) and 1.35V/1.5V (VDDQ) supply voltages, providing high-speed data transfer with a maximum operating clock frequency of 800MHz and a data rate of 1600Mbps/pin. It is housed in a 78-ball FBGA package, supporting 1.5V I/O (DDR3 compatible) and 1.35V I/O (DDR3L). Designed for applications requiring high speed, high bandwidth, and low power consumption, it offers programmable read/write burst lengths (BL8 or BC4/OTF) and programmable CAS latency (5, 6, 7, 8, 9, 10, 11, 12, 13, 14). It features programmable drive strength and on-die termination (ODT), with dynamic ODT and write leveling support to optimize signal integrity. The device supports auto refresh and self-refresh modes, as well as ZQ calibration commands to compensate for process, voltage, and temperature (PVT) variations. Operating temperature ranges cover commercial grade (0℃ ~ 95℃) and industrial grade (-40℃ ~ 95℃).

Key features

• High-speed data transfer: clock frequency up to 800MHz, data rate up to 1600Mbps/pin
• Low power consumption: 1.35V VDD and 1.35V/1.5V VDDQ supply voltage
• High density: 16M×8 banks×16-bit organization
• Programmable burst length: BL8 or BC4/OTF supported
• Programmable CAS latency: CL = 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 supported
• Programmable drive strength and on-die termination (ODT)
• Dynamic ODT and write leveling supported
• Auto refresh and self-refresh modes supported
• ZQ calibration for PVT variation compensation
• Operating temperature range: commercial grade 0℃ ~ 95℃, industrial grade -40℃ ~ 95℃